Taiwanese IC Packaging & Testing Industry, 3Q 2019 Report - ResearchAndMarkets.com

DUBLIN--()--The "Taiwanese IC Packaging & Testing Industry, 3Q 2019" report has been added to ResearchAndMarkets.com's offering.

The report finds that the shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.37 billion in the second first quarter of 2019, up 8.5% sequentially.

While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. Although the industry is anticipated to have seen a pickup in shipment value in the second half of 2019, the industry's shipment value is projected to witness a slight year-on-year decline in 2019 compared to 2018.

List of Topics:

  • This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
  • Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

Key Topics Covered:

  • Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2017 - 4Q 2019
  • Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2017 - 4Q 2019
  • Taiwanese IC Packaging Industry Shipment Value, 1Q 2017 - 4Q 2019
  • Taiwanese IC Testing Industry Shipment Value, 1Q 2017 - 4Q 2019
  • Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2017 - 2Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2017 - 2Q 2019
  • Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2017 - 2Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2017 - 2Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2017 - 2Q 2019
  • Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 2Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2017 - 2Q 2019
  • Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 2Q 2019
  • Exchange Rate, 1Q 2017 - 2Q 2019

Companies Mentioned

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • OSE
  • PTI
  • Sigurd
  • SPIL
  • Walto

For more information about this report visit https://www.researchandmarkets.com/r/unbgvh

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900