Global ESD Packaging Market Report 2019-2025 - ResearchAndMarkets.com

DUBLIN--()--The "ESD Packaging - Market Analysis, Trends, and Forecasts" report has been added to ResearchAndMarkets.com's offering.

The ESD Packaging market worldwide is projected to grow by US$1.8 Billion, driven by a compounded growth of 7%.

Communication Network Infrastructure, one of the segments analyzed and sized in this study, displays the potential to grow at over 8%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$1.6 Billion by the year 2025, Communication Network Infrastructure will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 8% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$81.7 Million to the region's size and clout in the next 5 to 6 years. Over US$85.2 Million worth of projected demand in the region will come from the rest of the European markets.

In Japan, Communication Network Infrastructure will reach a market size of US$149.3 Million by the close of the analysis period. As the world's second largest economy and the new game changer in global markets, China exhibits the potential to grow at 6.7% over the next couple of years and add approximately US$310.1 Million in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders.

Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific.

All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include:

  • AkzoNobel N.V.
  • BASF SE
  • DaklaPack Group
  • Desco Industries Inc.
  • Dou Yee Technologies Pte. Ltd.
  • DowDuPont Inc.
  • GWP Group
  • Miller Supply Inc.
  • Polyplus Packaging Ltd.
  • PPG Industries Inc.
  • TIP Corporation Sdn Bhd.
  • Uline

For more information about this report visit https://www.researchandmarkets.com/r/t1698u

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Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com
For E.S.T. Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900