SAN JOSE, Calif.--(BUSINESS WIRE)--Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today announced that global automotive supplier Yazaki North America has implemented Cypress’ instrument cluster solution to drive the advanced graphics in its instrument cluster for a leading American car manufacturer. Yazaki selected Cypress based on its unique offering of five chips that combine to drive dual displays and provide instant-on memory performance with automotive-grade, ASIL-B safety compliance. The Cypress solution is based on a Traveo™ microcontroller (MCU), along with two high-bandwidth HyperBus™ memories in a multi-chip package (MCP), an analog power management IC (PMIC) for safe electrical operation, and a PSoC® MCU for system management support.
“Our customer wanted an instrument cluster with rich graphics that would enhance the user experience for drivers and help differentiate their high-end crossover and truck models,” said Spencer Weidig, Senior Program Manager at Yazaki. “Working with a single, devoted supplier such as Cypress for multiple core components allowed for a cost-effective system solution and simplified the design process for this instrument cluster, which has been well received. The solution’s scalability helped us address three different vehicle levels efficiently.”
“As a company with deep automotive knowledge and technology expertise, Cypress has strived to stay ahead of the industry with high-performance, fail-safe automotive solutions,” said Sven Natus, Senior Director of the Automotive Business Unit at Cypress. “We take a long-term view of our collaboration with automotive suppliers such as Yazaki, offering them tailored solutions based on our broad portfolio of Traveo microcontrollers and leveraging our best-in-class fail-safe storage and data-logging, power management ICs and other technologies for added convenience.”
Cypress’ Traveo devices in the Yazaki instrument cluster were the industry’s first 3D-capable Arm® Cortex®-R5 cluster MCUs, and they provide greater memory savings, increased safety features and rich image capabilities. The MCU works seamlessly with Cypress’ HyperBus MCP device, which combines a high-speed, 512-Mbit NOR Flash device for fast-boot, instant-on capability and a 64-Mbit self-refresh DRAM for expanded scratchpad memory. The MCP enables bandwidth-intensive processing with low latency, and its low pin count simplifies designs compared to complex Double Data Rate (DDR) memories.
Cypress Enables Leading-Edge Automotive Systems
Cypress works with the world's top automotive companies to develop leading-edge automotive systems, including Advanced Driver Assistance Systems (ADAS), 3-D graphics displays, wireless connectivity, full-featured touchscreens and superior body electronics. Cypress’ automotive portfolio includes Traveo and PSoC microcontrollers (MCUs), CapSense® capacitive-sensing solutions, TrueTouch® touchscreen solutions, Wi-Fi®, Bluetooth® and USB connectivity solutions, power-management ICs (PMICs), and NOR Flash, F-RAM™ and SRAM memories. The portfolio is backed by Cypress' commitment to excellent service and adherence to the most stringent automotive industry standards. Learn more at www.cypress.com/automotive.
Cypress is the leader in advanced embedded solutions for the world’s most innovative automotive, industrial, smart home appliances, consumer electronics and medical products. Cypress’ microcontrollers, wireless and USB-based connectivity solutions, analog ICs and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and development resources on the planet enabling them to disrupt markets by creating new product categories in record time. To learn more, go to www.cypress.com.
Cypress, the Cypress logo, PSoC and CapSense are registered trademarks and Traveo, HyperBus and F-RAM are trademarks of Cypress Semiconductor Corp. All other trademarks are property of their owners.