Global Flip Chip Technology Market Analysis, Growth, Trends & Forecast 2018-2023, With an Expected CAGR of 5.64% - ResearchAndMarkets.com

DUBLIN--()--The "Global Flip Chip Technology Market - Segmented by Wafer Bumping Process, Packaging Technology, Product, Application, and Region - Growth, Trends, and Forecast (2018 - 2023)" report has been added to ResearchAndMarkets.com's offering.

The flip chip technology market was valued at US$22.683 billion in 2017, and is expected to reach a value of US$32.178 billion by 2023, at a CAGR of 5.64% over the forecast period 2018-2023.

Introduced by IBM 30 years ago, flip chip is keeping up with the times and developing new bumping solutions to serve advanced technologies, such as 2.5D and 3D. Flip chip is used for traditional applications, such as laptops, desktops, CPU, GPU, chipsets, etc. The demand for flip chips is expected to rise in mobile and wireless consumer applications, and other high performance applications, such as networks, servers, and data centers. The flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity along with its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative.

The Asia-Pacific flip chip market is expected to grow at a rapid pace, due to rising proliferation of consumer electronics in this region. With the improving economic conditions, increasing disposable income, increasing number of youth population, and rising employment rate, the consumer electronic market is flourishing in this region. China's plans to focus on semiconductor sector as a part of 12th five-year plan and strong growth of Taiwan's semiconductor and electronics industry will augment the market for Flip chip in this region.

Companies Mentioned

  • Amkor Technology Inc.
  • IBM Corporation
  • Intel Corporation
  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co. Ltd
  • Texas Instruments Inc.
  • GlobalFoundries U.S. Inc.
  • Stats ChipPAC Ltd
  • Nepes Pte Ltd
  • Powertech Technology

Key Topics Covered:

1. Introduction

2. Research Approach and Methodology

3. Market Insights

4. Market Dynamics

5. Technology Snapshot

6. Global Flip Chip Technology Market Segmentation

7. Competitive Intelligence - Company Profiles

8. Investment Analysis

9. Future of Flip Chip Technology Market

For more information about this report visit https://www.researchandmarkets.com/research/5vcjgt/global_flip_chip?w=4

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Semiconductor, Packaging, Processing Units

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Semiconductor, Packaging, Processing Units