LISLE, Ill.--(BUSINESS WIRE)--Molex has come together with industry leader Innovium to create a groundbreaking solution for customers migrating to QSFP-DD 400G. The solution will be showcased at the 2018 Open Compute Project (OCP) U.S. Summit, being held March 20-21 at the San Jose (CA) Convention Center.
Molex recently launched its QSFP-DD (Quad Small Form Factor – Double Density) Interconnect System and Cable Assemblies – designed to meet or exceed Ethernet, Fibre Channel, and InfiniBand port density requirements in high-speed enterprise, telecommunications and data networking equipment – to meet the rising demand for 100 Gbps, 200 Gbps and 400 Gbps networking solutions. Bringing together that system with Innovium’s TERALYNXTM switch chip means better performance and operational efficiencies for data center customers.
“By leveraging the combined capabilities of Innovium’s TERALYNX 12.8 Tbps switch chips and Molex QSFP-DD interconnect technology, we enable state of the art next generation data center topologies,” said Scott Sommers, group product manager, Molex.
The industry’s smallest 400 Gbps Ethernet module providing the highest port bandwidth density, Molex’s QSFP-DD form factor features an 8-lane electrical interface that transmits up to 28 Gbps NRZ or 56 Gbps PAM-4 for an aggregate bandwidth of up to 200 Gbps NRZ or 400 Gbps PAM-4, with an upgrade path toward 800 Gbps PAM-4 using 112 Gbps PAM-4. Molex QSFP-DD pluggable modules and connectors, cages and cables are backward compatible with existing QSFP+ interconnects for functionality across a wide variety of legacy and next-generation technologies and applications.
“Innovium’s TERALYNX was developed using innovative design techniques based on a ground-up architecture, delivering to data center customers the highest performance network switch silicon with superior buffering, latency and programmability. We are excited to collaborate with Molex to deliver highly scalable network solutions for current and next-generation data centers,” said Amit Sanyal, vice president of product management and marketing, Innovium.
The Innovium TERALYNX product line delivers the fastest and most scalable Ethernet switch silicon family with leading analytics, programmability, and power efficiency. TERALYNX is the industry’s first switch that achieves 12.8 Terabits per second (Tbps) performance in a single-chip, while delivering robust tunneling, large buffers, line-rate programmability, best-in-class low-latency and breakthrough telemetry, resulting in a 6x advantage compared to alternatives. TERALYNX includes broad support for 10/25/40/50/100/200/400GbE Ethernet standards that can be flexibly configured to deliver 128 ports of 100GbE, 64 ports of 200GbE or 32 ports of 400GbE in a single device. For more information about Innovium TERALYNX, please visit: http://www.innovium.com.
For more information about Molex QSFP-DD Interconnect System please visit, www.molex.com/link/datacenter.html.
Innovium is a provider of high performance, innovative switching silicon solutions for data centers. Innovium TERALYNXTM family delivers software compatible products ranging from 3.2Tbps to 12.8Tbps with unmatched power efficiency, radix, programmability, buffers and low latency. Innovium team members have a highly successful track record in delivering several generations of widely deployed data center products. The company is headquartered in Silicon Valley, California and is backed by leading venture capital firms including Greylock Partners, Walden Riverwood, Capricorn Investment Group, Qualcomm Ventures, S-Cubed Capital and Redline Capital. For more information, please visit: http://www.innovium.com.
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive and commercial vehicle. For more information, please visit www.molex.com.
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