Global ESD Packaging Market 2017-2022: Miniaturization of Electronic Devices Coupled with Growing Demand for Smart Phones and Smart Devices - Research and Markets

DUBLIN--()--The "Global ESD Packaging Market - Forecasts from 2017 to 2022" report has been added to Research and Markets' offering.

The global ESD packaging market was valued at US$2.971 billion in 2017 and is expected to grow at a CAGR of 7.25% to reach a market size of US$4.216 billion by the year 2022

Electrostatic discharge materials are those plastic materials which decreases static electricity in order to protect electrostatic sensitive devices. The electrostatic discharge materials should be packaged carefully as they can contain flammable liquids or gases. They can be packaged with foam and cushioning products such as anti static foam, conductive foam and antistatic bubble wrap. Safe tubing and sheeting roll stocks are also used for this purpose as a company can create bags with the help of safe poly tubing and roll stock materials can be used to create protective covers and wall partitions.

The prime factor behind the global growth of ESD packaging can be attributed to miniaturization of electronic devices coupled with growing demand for smart phones and smart devices. Factors like rising trend if IoT (Internet of things) and improving ICT infrastructure coupled with penetration of internet drive the demand for smart phones and devices while augmenting the global ESD packaging market.

In addition to this, high adoption of technology in automobiles coupled with high speed innovation creates ample opportunities for the market to grow over the projected period. However, strict regulations for specific materials may restrain the growth prospects of ESD packaging market on a global platform.

Key Topics Covered:

1. Introduction

2. Research Methodology

3. Executive Summary

4. Market Dynamics

5. Global ESD Packaging Market Forecast by End Users(US$ billion)

6. Global ESD Packaging Market Forecast by Geography (US$ billion)

7. Competitive Intelligence

8. Company Profiles

  • TIP Corporation
  • Polyplus Packaging Ltd,
  • BASF SE
  • Miller Supply Inc.
  • Desco Industries
  • DowDuPont
  • PPG Industries

For more information about this report visit https://www.researchandmarkets.com/research/s5khbr/global_esd

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Related Topics: Electrical Engineering, Packaging

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Related Topics: Electrical Engineering, Packaging