SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced today that it will be featuring its leading Electronics Assembly solutions at the upcoming SEMICON China 2017 and NEPCON Korea 2017 trade shows.
The accuracy, throughput and flexibility of K&S’ Electronics Assembly offerings are well suited to meet the growing trends towards miniaturization and functional integration within electronics devices. These high-reliability focused solutions, which allow for manufacturing line productivity optimization, are well positioned for the automotive and industrial markets.
“Driven by increased electronics in automotive, adoption of smart manufacturing and deployment of IoT devices across various market segments, the Electronics Assembly market is expected to grow and evolve in the coming years. Our R&D investments and strategic roadmap in Electronics Assembly have provided a unique set of competitive solutions we believe will provide great value to our customers in this highly dynamic market space,” said Fusen Chen, Kulicke & Soffa’s President and Chief Executive Officer.
Kulicke & Soffa will be holding a technical seminar during the NEPCON Korea 2017 trade show on April 6, at Oakwood Premier Coex, to share on K&S’ comprehensive assembly and packaging solutions.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices. (www.kns.com)