The research study covers the present scenario and growth prospects of the global anti-static packaging market for 2016-2020. In addition, the report discusses the major drivers that influence the growth of the global anti-static packaging market. It also outlines the challenges faced by vendors and the market at large as well as the key emerging trends.
The increased demand for mini semiconductor integrated circuits (ICs) such as 3D ICs for the manufacture of easily portable, lightweight, and cost-effective devices will drive the demand for anti-static packaging during the forecast period. This is because the compact packaging of these circuits often results in triboelectric charging, which can be prevented using anti-static packaging products.
Request a sample report: http://www.technavio.com/request-a-sample?report=53867
Technavio’s sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more.
Technavio transportation and logistics analysts highlight the following four factors that are contributing to the growth of the global anti-static packaging market:
- Unique ability to reduce static charge build-up
- Increasing miniaturization of electronic devices
- Growing global demand for smartphones and smart devices
- Short life cycle of electronic products
Unique ability to reduce static charge build-up
Anti-static packaging reduces the build-up of static charge due to friction between material surfaces. Because of this unique functionality, anti-static packaging is useful for various products such as consumer electronics and computer peripheral; static charge build-up on the surfaces of these products can cause considerable damage.
Sharan Raj, a lead packaging analyst at Technavio, says, “The growth of the electronics, industrial packaging, gaming, and digital signage markets provides a lucrative opportunity for vendors in the anti-static packaging market. The demand for anti-static packaging is anticipated to grow in these applications and drive the global anti-static packaging market.”
Increasing miniaturization of electronic devices
There has been an increase in the demand for mobility in electronic devices worldwide. To be portable and cost-effective, devices need to be lightweight and small. Thus, the increased demand for mobility has translated into a trend toward the adoption of smaller devices. The popularity of smaller devices in multiple sectors (telecommunications, automotive) has, in turn, led to miniaturization of semiconductor ICs. With advances in technology like 3D ICs and micro-electromechanical systems (MEMS) as well as changes in the designs of ICs such as finer patterning, electronic devices are becoming more compact and user-friendly.
“The miniaturization of semiconductors has resulted in innovative developments in anti-static packaging. Packaging technologies such as flip-chip, SiP, PoP, and WLP have emerged. A conductive bump is soldered on top of the flipped chip in flip-chip packaging, which acts as an interconnect with the substrate or lead frame,” adds Sharan.
Growing global demand for smartphones and smart devices
An increase in the global sales of smartphones and smart devices, which have many ICs integrated together, has fueled the growth of the anti-static packaging market. Smartphones and tablets are a major application of ICs and semiconductors. Features such as touchscreens, Wi-Fi connectivity, multimedia streaming, and access to the internet are available in these devices due to the signals generated within the high-tech circuits present in these devices. As these devices are becoming smaller in size due to the use of high-density circuits, the demand for anti-static packaging is growing significantly. The launch of the Apple Watch has boosted the semiconductor packaging and testing industries in China.
Short life cycle of electronic products
Rapid advances in technology and stiff competition among the players in the global electronics market have shortened the life cycle of complex electronic products and increased the frequency of introduction of new products in the market. To launch new products quickly and effectively, OEMs are continuously designing and manufacturing high-performance electronic products that are compact, scalable, and flexible enough to allow design changes with minimal investments. This has opened up opportunities for PCB manufacturers to address the time-to-market and high production volume concerns of OEMs by delivering technologically complex PCBs that accommodate high operational speeds and increased component densities.
- Dow Chemical
Browse Related Reports:
- Global Honeycomb Paperboard Packaging Market 2016-2020
- Global Semiconductor Packaging Equipment Market 2016-2020
- Global On-the-go Packaging Market 2016-2020
Do you need a report on a market in a specific geographical cluster or country but can’t find what you’re looking for? Don’t worry, Technavio also takes client requests. Please contact email@example.com with your requirements and our analysts will be happy to create a customized report just for you.
Technavio is a leading global technology research and advisory company. The company develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries. Technavio has about 300 analysts globally who specialize in customized consulting and business research assignments across the latest leading edge technologies.
Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.
If you are interested in more information, please contact our media team at firstname.lastname@example.org.