DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Global Semiconductors Packaging materials Market - by Packaging type, Regions - Market Size, Demand Forecasts, Industry Trends and Updates (2014-2020)" report to their offering.
The global semiconductors packaging materials market is forecast to grow at a CAGR of 4.74% during the 2016-2020 period.
The APAC dominated the semiconductors packaging materials market with the maximum market share for the year 2014. Countries like China, Taiwan, Japan and South Korea witnessed the strongest demand in the region. A similar trend is expected until 2020 with the APAC market growing at a CAGR of 5.06%. Europe and North America are expected to grow at a slower CAGR of 3.15% and 3.28% respectively.
This market is primarily driven by high demand from the electronics components industry which faces pressure to serve the ever growing human population. Advancements and rapid changes in technology are the other drivers governing the industry. An increased demand for multifunctional and high performance chips is creating a need to bring about newer versions of products at a rapid pace. An example of the same is the 3D IC. Also, these devices in future would be used in multiple applications.
Currency fluctuations throughout the world have proven to be detrimental for the market. Another challenge for the market has been high dependency of the semiconductor packaging materials on the semiconductor equipment industry itself.
- Amkor Technology
- Heesung Metal
- Honeywell International
- Mitsui High-Tec
1. Executive Summary
2. Market Overview
3. Market Dynamics
4. By Packaging type
5. By Region
6. Vendor Market Share Analysis
7. Company Profiles
8. Industry Structure
9. Industry M&As, Consolidations
10. Investment Opportunities
11. Global Semiconductors Packaging materials Market- Road Ahead
For more information about this report visit http://www.researchandmarkets.com/research/hlf47p/global