TAIPEI, Taiwan--(BUSINESS WIRE)--To accelerate 3D video content popularization, eYs3D joins Etron to develop the world's fastest 3D depth-map capturing controller chipset: the eSP876, with speeds at 720p resolution level of up to 60 frames per second and support for USB3.0 Ultra High Speed transmission interface. Its advantages of a small slim size, best cost-price ratio and highly-integrated IC technology enable it to be embedded easily in TVs, smart displays, laptops, tablets and smartphones, allowing consumers to create their very own personal 360o VR video content and experience extraordinary “Real Reality” and “Virtual Reality” (RR/VR)!
The eSP876 chip simultaneously controls the timing and image quality of two horizontally placed HD cameras to mimic the function of human eyes in capturing 3D images or videos. The eSP876, while connected to two sensors using either parallel or MIPI interfaces, executes sophisticated parallel computational algorithms, and outputs high performance depth-map images of up to HD resolution at 720p of 60 frames per second. With the USB3.0 interface, eSP870 delivers high-performance depth-map images in 3D or 2D instant video and simultaneously enables 3D gesture / skeleton recognition of both hand and full-body tracking controls. During the process of 3D image capturing, the eSP876 can be used in a natural light environment with high flexibility; no active light sources (such as flashlights or infrared lasers) are needed.
The 3D images captured by the eSP876 can be the depth-map data for hand tracking and full-body tracking controls, offering system companies 3D images for a vast range of VR applications. Etron will display the latest innovative 3D capturing ICs and relevant VR applications at booth No. D0725a, Hall 1, Taipei World Trade Center on May 31 - June 4, 2016.
About eYs3D Microelectronics, Co.
eYs3D Microelectronics, Co. is a world leading company in 3D image capture designs and solutions.
About Etron Technology, Inc
Etron Technology, Inc. (Taiwan GTSM: 5351) is a world-class fabless IC design and product company, specializing in application-driven buffer memory and system-in-package, including CEDRAM, KGDM, USB Type-C high speed controller chipsets and 3D Depth-Map / Spherical 360°x3D video capturing chipsets.
For further information, please visit www.etron.com