Flip Chip Technology Market worth 31.27 Billion USD by 2022 - Research and Markets

DUBLIN--()--Research and Markets has announced the addition of the "Flip Chip Technology Market by Wafer Bumping Process, Packaging Technology, Application and Geography - Global Forecast to 2022 " report to their offering.

The flip chip technology market is expected to grow from USD 19.01 billion in 2015 to USD 31.27 billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in the consumer electronics market.

CPUs packaged using the flip chip technology are estimated to hold the largest market share during the forecast period. The market for LED is expected to gain traction and grow at the highest CAGR in the next six years. These are the most sustainable product segments for the flip chip technology market. CPUs have a wide range of applications in computers, smartphones (application processor), high-end networks such as servers, wearables, and now automotive. The performance of application processor in smartphones and tablets remains a key feature leading to fierce competition among brands. Therefore, increasing need for more functionality and reduced package size is expected to drive the integration of flip chip technology in baseband and application processors for mobile platforms.

APAC accounted for the major market share of the overall flip chip technology market in 2015. Moreover, the market in APAC is expected to grow at the highest CAGR between 2016 and 2022. Asia-Pacific is a major manufacturing hub and expected to provide ample opportunities for the growth of flip chip technology. The growing demand for high performance in smartphones and automotive MCUs is driving the market in this region.

Key Topics Covered:

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights

5 Market Overview

6 Industry Trends

7 Flip Chip Technology Market, By Wafer Bumping Process

8 Flip Chip Technology Market, By Packaging Technology

9 Flip Chip Technology Market, By Packaging Type

10 Flip Chip Technology Market, By Product

11 Flip Chip Technology Market, By Application

12 Geographic Analysis

14 Company Profiles

Companies Mentioned:

  • ASE Group
  • Amkor Technology
  • Intel Corporation
  • JCET, Co., Ltd.
  • Powertech Technology
  • SPIL, Co., Ltd.
  • STATS ChipPAC
  • Samsung
  • TSMC, Ltd.
  • United Microelectronics Corporation

For more information visit http://www.researchandmarkets.com/research/sdxr4p/flip_chip

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Sector: Computing and Technology

Contacts

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing and Technology