IXYS Introduces High Performance Copack IGBT and Diode in the ISO247 Package with Lowest Weight, Great Thermal Rating and Isolation

LEIDEN, Netherlands--()--IXYS Corporation (NASDAQ:IXYS), a leader in power semiconductors and IC technologies for energy efficient products used in power conversion, telecommunications, medical, consumer and motor control applications, today introduced the ITF48IF1200HR in an ISO247 package with its proprietary DCB, with the lowest thermal resistance, lowest weight and high voltage isolated backside. This new package enables higher current and power ratings when compared to other isolated package technologies.

The new ISO247 package is a direct replacement for the TO247 package as it has the same dimensions and a mounting hole like the TO247. With a 3kV internal insulation to the heatsink, the new ISO247 is therefore simpler to isolate and mount. The ISO247 is a new member of the ISOPLUS family which offers isolated package versions of industry standard packages such as TO247 and TO264 with the same footprint. Compared to the ISOPLUS247 series, the ISO247 gives the user a further improvement in thermal resistance which can be used for either higher output current or improved reliability at the same power level. A patented package construction allows the usage of the ISO247 package without using thermal grease, and offers a lower junction to heatsink thermal resistance than the standard isolation of a TO247 with a thermal pad.

ITF48IF1200HR is a copack of a fast 1200V Trench IGBT and soft recovery SONIC diode at a rated IGBT current of 48A at a case temperature of 100 degrees C. Turn off energy per pulse is 2.4 millijoules when turning off a current of 40A at a bus voltage of 600V and a junction temperature of 150 degrees C. Further features are a maximum junction temperature of 175 degrees C and a short circuit capability of 10 microseconds.

“We developed DCB based discrete type packages where we replaced the heavy copper header with the DCB header as part of our patented leadframe technology. This enables better thermal performance, lower weight and total electrical isolation of the backside from the heatsink the device will be mounted on in the application. The better thermal expansion coefficient match between the Si die and the DCB header offers better thermal cycling ratings than standard ‘TO’ type packages,” commented Dr. Nathan Zommer, CEO and CTO of IXYS Corporation.

“The new ITF48IF1200HR copack IGBT in the ISO247 package will provide our customers a cost effective assembly solution by allowing a reduction in system size and weight without compromising energy efficiency. Any TO247 package can be replaced by the new ISO247 package providing less effort in mounting and an increase in reliability,” states Dr. Elmar Wisotzki, Director of Technology at IXYS Germany. “This latest addition to our ISO247 product portfolio gives our customer the benefit of more compact designs at lower cost.”

ITF48IF1200HR is ideally suited for cost sensitive but high reliable 3phase, solar and resonant inverters, motor control applications, UPS, SMPS, portable inverters, generators, welding equipment, high power electric tools, and applications in the transportation markets, where weight reduction is needed, such as automotive, airplanes and aerospace systems.

The following rectifier, thyristor (SCR) and IXYS’ dual SCR DT-Triac products are available in ISO247 packages:


    ISO247, HiPerFRED phase-leg; 30A; 2 x 600V


ISO247, rectifier phase-leg; 10A; 2 x 1200V


ISO247, rectifier phase-leg; 50A; 2 x 1200V


ISO247, rectifier phase-leg; 30A; 2 x 1600V


ISO247, single high efficiency SCR; 40A; 1200V


ISO247, single SCR; 40A; 1600V


ISO247, single DT-Triac; 30A; 1200V


ISO247, single DT-Triac; 40A; 1200V


ISO247, common cathode Schottky diode; 2 x 45A; 200V


ISO247, single CoolMOSTM CFD; 0.08 Ohm; 650V

CoolMOSTM is a trademark of Infineon Technologies

More product information is available on the IXYS website or by contacting your nearest IXYS sales office.

About IXYS Corporation

Since its founding, IXYS Corporation has been developing power semiconductors and mixed signal ICs to improve power conversion efficiency, generate solar and wind power and provide efficient motor control for industrial applications. IXYS and its subsidiary companies offer a diversified product base that addresses worldwide needs for power control in the growing cleantech industries, renewable energy markets, telecommunications, medical devices, transportation applications, flexible displays and RF power.

Safe Harbor Statement

Any statements contained in this press release that are not statements of historical fact, including the benefits, savings, efficiency, performance, features and suitability of products for various applications, may be deemed to be forward-looking statements. There are a number of important factors that could cause the results of IXYS to differ materially from those indicated by these forward-looking statements, including, among others, risks detailed from time to time in the Company's SEC reports, including its Form 10-Q for the quarter ended December 31, 2015. The Company undertakes no obligation to publicly release the results of any revisions to these forward-looking statements.


for IXYS Corporation
Andreas Laschek-Enders, +49 (0) 6206 503 201


for IXYS Corporation
Andreas Laschek-Enders, +49 (0) 6206 503 201