LONDON--(BUSINESS WIRE)--Technavio has announced the top six leading vendors in their recent semiconductor packaging and test market in China report. This research report also lists 10 other prominent vendors that are expected to impact the market during the forecast period.
Competitive vendor landscape
This report by Technavio establishes that the semiconductor equipment industry is an essential part of the semiconductor device making industry. The device making companies invest one-fifth of the revenue generated from the sales of new equipment. The market also faces a technological gap between advanced foreign and Chinese equipment.
The packaging and test equipment market is a part of the total semiconductor equipment industry. Thus, factors that affect the semiconductor equipment industry in a way affect the packaging and test market.
According to Asif Gani, a lead research analyst at Technavio for semiconductor equipment, “Rising costs of packaging and test equipment make leading chip manufacturers sell off their packaging and test facilities, and focus more on partnerships and mergers in order to outsource their packaging and testing of chips. Companies such as ASE and Intel are investing or acquiring considerable shares in facilities for leading packing and test manufacturers, thereby reducing total costs.”
Top six vendors for semiconductor packaging and test market in China
Amkor Technology was founded in 1968 and is headquartered in Arizona, US. The company offers advanced semiconductor assembly and test services. The company also provides services including package design and development, wafer bumping and redistribution services, wafer probe and package test, assembly, and final test.
The company's products are categorized into the following segments:
Advanced products: The segment offers flip chip, wafer-level processing, flip chip ball grid array packages, and test-related services.
Mainstream products: The segment includes leadframe packages, micro-electro-mechanical systems packages, and substrate base wire bond packages.
ASE was established in 1984 and is headquartered in Taiwan. The company provides semiconductor packaging and testing services all over the world. The company also offers complete turnkey solutions covering IC packaging, production, and design of interconnect materials; wafer probing and final test; front-end engineering test; and electronic manufacturing services by Universal Scientific Industrial.
As of January 2015, the company had 7,073 number of employees and spent USD 0.34 billion in R&D.
Powertech Technology was founded in 1997 and is headquartered in Taiwan. The company provides IC backend services that cover IC chip probing, packaging, final testing and burn in to end products with drop shipments to customers worldwide.
As of December 2014, the revenue generated by the company was USD 1.32 billion and the company spent USD 36.6 million in R&D.
Siliconware Precision Industries (SPIL)
SPIL was established in 1984 and is headquartered in Taiwan. The company is engaged in IC packaging, processing, trading, testing, and other related fields. The company's products are widely utilized in business consumer electronics, communications products, PC, and memory products.
As of December 31, 2014, the company generated USD 2.73 billion and invested USD 0.12 billion in R&D. It has 23,611 employees. Some of its subsidiaries include SPIL, Siliconware USA, and Siliconware Technology.
STATS ChipPAC was established in 1994 and is headquartered in Singapore. The company is a service provider of semiconductor packaging design, bump, probe, assembly, test, and distribution solutions.
STAT ChipPAC provides advanced semiconductor packaging and test services to a diversified global customer base that serves the communication, consumer, and computing markets. The company has manufacturing facilities in South Korea, Singapore, China, and Taiwan and markets its products in South Korea, China, Singapore, Taiwan, the US, and Switzerland.
UTAC was founded in 1997 and is headquartered in Singapore. The company provides semiconductor assembly and testing services for a wide range of ICs including analog, mixed-signal, and memory for integrated device manufacturers, wafer foundries, and fabless companies.
The company established its presence in the semiconductor packaging and test market with offerings such as laminate packaging, leadframe packaging, and wafer level packages. The company implemented several strategic initiatives aimed at improving its position in the sector.
In April 2015, the company introduced a 0.3-mm thin QFN package and a service location protocol process to improve QFN solder joints for aerospace, automotive, and other harsh environmental applications.
Browse Related Reports:
- Semiconductor Production Equipment Market in Taiwan 2015-2019
- Global Semiconductor Silicon Wafer Market 2015-2019
- Global Semiconductor Capital Equipment Market 2015-2019
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Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.
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