BEIJING & STAINES UPON THAMES, England--(BUSINESS WIRE)--VeriSilicon Holdings Co., Ltd. (VeriSilicon) and NextG-Com Limited (NextG-Com) today announced a joint partnership to develop next generation Cat-0/Cat-M reference platforms. The joint partnership will incorporate physical layer technology running on VeriSilicon’s ZSPTM cores with NextG-Com’s ALPSLiteTM LTE Cat-0 protocol stack running on a host central processing unit (CPU).
NextG-Com is a market leader in providing cellular connectivity solutions for internet of things (IoT) and machine to machine (M2M) applications. ALPSLite is the industry’s first 3GPP Cat-0 protocol stack specially designed for IoT applications. VeriSilicon is a Silicon Platform as a Service (SiPaaS™) company providing comprehensive semiconductor IP and custom silicon turnkey service for worldwide industry leading customers. VeriSilicon’s innovative ZSP technology strikes the perfect balance of performance, power and cost to meet the needs of IoT and M2M platforms.
“LTE-enabled IoT is a significant market opportunity and strategic focus for NextG-Com. We have secured multiple design wins to-date for our ALPSLite protocol stack, but there is increasing demand for more complete solutions integrated with a physical layer,” said Denis Bidinost, Chief Executive Officer of NextG-Com. “The strategic partnership with VeriSilicon is extremely important and highly complementary. Our ALPSLite protocol stack together with VeriSilicon’s physical layer and ZSP cores, completes the offering to target a number of IoT markets which require an integrated customized cellular connectivity solution.”
Dr. Wayne Dai, Chairman, President and CEO of VeriSilicon stated, “LTE Cat-0 and Cat-M connectivity are expected to be widely deployed for IoT and M2M applications. Since launch of our first generation ZSP family, scalable ZSP cores have been successfully adopted in diverse wireless terminals. We are pleased to collaborate with NextG-Com on these next generation, innovative IoT platforms. A highly customisable and ultra lightweight protocol stack solution, integrated with our best-in-class DSP technology (ZSP) and optimal LTE PHY reference design, provides a complete and flexible LTE Cat-0/Cat-M platform for customers to meet the requirements of low cost, low power, large coverage and faster system integration in the IoT and M2M markets.”
NextG-Com Limited is a market leading developer and supplier of next generation IP products for LTE, Satellite and other technologies specially customized for IoT solutions. It was founded in 2008 with headquarters in Staines upon Thames, United Kingdom. NextG-Com has proven track record of working with global tier1 semiconductor partners successfully delivering complex connectivity solutions. It offers wide variety of services covering all aspects of modem development along with their innovative products enabling customers to deliver quality solutions to market and significantly reducing time to market. With clear roadmap of MTCe, NB IoT, NextG-Com positions itself to be market leaders in next generation LPWA LTE connectivity solutions for IoT/M2M market. For more information about NextG-Com, please visit us at www.nextgcom.co.uk.
VeriSilicon Holdings Co., Ltd. is a Silicon Platform as a Service (SiPaaS™) company that provides IP-centric, platform based custom silicon solutions and end-to-end semiconductor turnkey services for a wide range of applications across a wide variety of end markets including mobile internet devices, datacentres, the Internet of Things (IoT), wearable electronics, smart homes, and automotive. VeriSilicon’s silicon platforms include licensable ZSP® (digital signal processor) based HD audio, HD voice, multi-band and multi-mode wireless platforms, Hantro HD video platforms, wearable electronics platforms, IoT platforms, mixed signal NUI (natural user interface) platforms for voice, motion and touch interface. VeriSilicon’s custom silicon turnkey service encompasses design service that combines its technology solutions and value-added mixed signal IP portfolio targeted for a wide range of process technology nodes, including advanced nodes like 28nm, 22nm FD-SOI, FinFET and provide product engineering service for System on a Chip (SoC) as well as System in a Package (SiP). VeriSilicon’s SiPaaS solutions shorten design cycle, enhance quality, and reduce risk. The breadth and flexibility of SiPaaS solutions make it an attractive alternative for a variety of customer types, including both emerging and established semiconductor companies, Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and large Internet platform companies. Founded in 2001 and head-quartered in Shanghai, China, VeriSilicon has over 500 employees with six R&D centres (China, US and Finland) and nine sales offices worldwide. For more information about VeriSilicon, please visit www.verisilicon.com.