PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for the microtechnology industry, today announced the µFlexTM Series multi-axis precision laser micromachining platform, enabling new levels of price-performance in laser applications for consumer electronics, medical devices, automotive components, and many other industries. The company also announced the shipment of a volume order of this new mid-range platform, the first with ESI-developed and manufactured lasers.
The µFlexTM (Flex for flexible and modular) Series enables industrial designers to rapidly prototype new and exciting designs that differentiate their products from the competition. Process engineers can then use the µFlexTM to build high-volume manufacturing processes with reduced cost of ownership that address a wide variety of laser processes including advanced marking, cutting, drilling, and ablating. The µFlexTM Series, the first mid-range priced platform from ESI, handles all the newest materials from fabrics to metals to ceramics, glass (including strengthened glass) and sapphire. This unprecedented flexibility comes from a modular approach that allows the use of a wide range of laser technologies, including lasers that have been designed and built by ESI to deliver specific capabilities with highly competitive price/performance.
“From mobile devices to automobiles, industrial designers and process engineers are increasingly taking advantage of lasers to process materials with complex designs that weren’t possible just a few years ago,” said Edward C. Grady, president and CEO of ESI. “This is particularly true in fast-moving consumer electronics markets where new materials are being developed and deployed at incredible speeds. The µFlexTM Series is the first laser micromachining solution that can handle such diversity, giving our customers a competitive advantage while reducing total cost of ownership.”
The Next Generation
The µFlexTM Series builds on ESI’s track record and expertise to offer far more versatility in material selection and processing than possible previously. It can be easily configured to accommodate a wide variety of laser wavelengths, powers, and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. An ESI-proprietary real-time control system synchronizes the timing of laser pulses with laser beam positioning and movement of the work surface.
Space is always at a premium on the manufacturing floor, and the µFlexTM Series was developed to minimize floor space and maximize performance. The total footprint of the µFlexTM Series is as small as 1.7 square meters. The platform can accept a wide range of industry-standard automation technologies for loading and unloading parts. This combination adds even more value to the cost of ownership equation.
The µFlexTM Series is now available worldwide with options for ultraviolet, infrared, CO2 and green lasers, including ESI-manufactured lasers. For more information go to: http://www.esimicroflex.com
ESI has a long history of harnessing the power of laser light and putting it into advanced micromachining solutions. These solutions are easy-to-use for designers, R&D, and high volume manufacturing operations.
ESI technology solutions allow industrial designers and process engineers to harness the power of laser light to transform materials in ways that to differentiate their consumer electronics, wearable devices, electronic circuits and precision goods for market advantage. ESI laser-based manufacturing solutions feature the microtechnology industry’s highest precision and speed with lowest total cost of ownership. Founded in 1944, ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.