Research and Markets: Flip-Chip Trends - Global Market Overview 2014

DUBLIN--()--Research and Markets ( has announced the addition of the "Flip-Chip Trends" report to their offering.

Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by its benefits in terms of performance, size, reliability, flexibility and cost in comparison to other packaging methods.

The report analyzes and presents an overview of Flip-Chip market worldwide. Supported with 2 market data tables, the report provides a review of market trends, applications, advantages of Flip-Chip technique, and further highlights on various strategic industry activities of major companies witnessed by the industry over the last few years.

In addition, 28 companies operating in the Flip-Clip arena worldwide are profiled, including

- Amkor Technology Inc.

- FlipChip International LLC

- Kyocera America Inc.

- NTK Technologies Inc.

- Philips Lumileds Lighting Company

- Signetics Corporation

- STATS ChipPAC Ltd.

- STMicroelectronics NV

- Tessera Technologies Inc.

- Toshiba Electronics Europe GmbH

Key Topics Covered:


  • A Prelude
  • Flip-Chip - Enabling Compact, Smart Devices
  • Flip-Chip - Applications
  • Advantages of Flip-Chip Technique
  • High Packaging Density
  • High Performance
  • Ruggedness
  • Cost-efficiency
  • Flip-Chips Package Design
  • Manufacturing of Flip-Chip Assemblies


  • Flip-Chip Technique Extends to New Applications
  • Table 1: Global Flip Chip Market (2012-2017) in US$ Million
  • Table 2: Global Flip Chip Market by Application (2012-2017) in Million Units for Aerospace and Defense, Automotive, Industrial and Medical, Consumer, Computing, and Telecommunications
  • Latest Chip Interconnection Techniques Drive Flip-Chip Adoption
  • WLP Gradually Replaces Flip-Chips in Compact Products


  • FlipChip International Inks Partnership Agreement with EZconn Czech
  • Philips Lumileds Introduces LUXEON Flip Chip LEDs
  • Altera Selects FCmBGA Packaging Solution of Amkor Technology
  • FlipChip International Takes Over Millennium Microtech Holdings
  • FlipChip International Forms Joint Venture with Millennium Microtech
  • Kyocera America Sets Up New Clean Room
  • Shinkawa Unveils LFB-1102 Flip-Chip Bonder for TCB Substrate Process
  • Signetics to Expand Flip-Chip Package Assembly Capacity
  • STATS ChipPAC Introduces fcCuBE Flip-Chip Packaging Technology
  • Philips Lumileds Unveils LUXEON Rebel LEDs
  • STATS ChipPAC Launches LCFC Technology with Copper Column Bump
  • Tessera Inks Licensing Agreement with Nanium
  • Zicom Group Purchases Controlling Stake in Orion Systems Integration


  • Amkor Technology, Inc. (USA)
  • ASE Group (Taiwan)
  • ASE Kaohsiung (Taiwan)
  • Belton Technology Group (China)
  • Faraday Technology Corporation (Taiwan)
  • FlipChip International LLC (USA)
  • GigOptix, Inc. (USA)
  • Ibiden Co., Ltd. (Japan)
  • Kyocera America, Inc. (USA)
  • LSI Corporation (USA)
  • Nanium (Portugal)
  • NTK Technologies, Inc. (USA)
  • Philips Lumileds Lighting Company (USA)
  • Reflex Photonics, Inc. (Canada)
  • Renesas Electronics America, Inc. (USA)
  • Shinko Electric Industries Co., Ltd. (Japan)
  • Signetics Corporation (South Korea)
  • Siliconware Precision Industries Co., Ltd. (Taiwan)
  • STATS ChipPAC Ltd. (Singapore)
  • STMicroelectronics NV (Switzerland)
  • Tektronix Component Solutions (USA)
  • Tessera Technologies, Inc. (USA)
  • Tokyo Electron Ltd. (Japan)
  • Toshiba Electronics Europe GmbH (Germany)
  • Toshiba Semiconductor & Storage Products (Japan)
  • Unisem Advanced Technologies Sdn. Bhd. (UAT) (Malaysia)
  • UTAC Holdings Ltd. (UTAC Group) (Singapore)
  • Valtronic Technologies (Suisse) SA (Switzerland)


For more information visit


Research and Markets
Laura Wood, Senior Manager.
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks


Research and Markets
Laura Wood, Senior Manager.
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks