CAEN, France--(BUSINESS WIRE)--Presto Engineering, Inc., a world leader in semiconductor back-end turnkey production services, is pleased to announce its participation in the MACSPACE consortium. The consortium brings together some of the top European technology companies and universities to research and develop high-performance computer processors that can meet the specialized requirements of space flight and manage the massive amount of data generated during space missions.
“The ability to analyze data in space, make real-time decisions and obtain better situational awareness will greatly enhance mission capabilities,” said Ran Ginosar, CEO, Ramon Chips, an Israel-based semiconductor company that is coordinating the consortium. “Consequently, we need higher-performance computing systems that can handle the massive amount of data being generated during modern space missions. The MACSPACE consortium is a major step for Europe toward developing onboard computing technologies that consume a fraction of the power used by current technologies.”
Presto Engineering, along with Germany-based DSI Informationstechnik, will work on characterizing and testing the prototype computer system. According to Cédric Mayor, Vice President Technology and Marketing, Presto Engineering, Inc., “We are very honored to be part of this very important initiative. The ambitious, multidisciplinary project involves the development of a computer system that combines very high performance with low power consumption, small size and light weight, so that it is practical for use on space craft. It needs to be robust enough to withstand the harsh environment of space, where temperatures range from -55 to 125 degrees Celsius and radiation accelerates aging. And, of course, it needs to be reliable, since space missions can last many years.”
The collaborative project is funded by the European Commission under the FP7 SPACE programme (grant no 607212) and is managed by the Research Executive Agency. It is expected to last approximately three years.
The consortium includes a very complementary team, including: Thales Alenia Space Italia, the European leader for satellite systems and orbital infrastructure as an excellent representative of the customer base for this technology, which will drive requirements and subsequently test the system; CEVA, a leading IP DSP core provider, which will develop the computer processor’s specialized core; Technische Universitaet Braunschweig, the oldest institute of technology in Germany, which will be responsible for benchmarking and evaluating the work; and Arttic, a European specialist in the set-up and management of collaborative international research and development projects, which will assist with the operations of the consortium and the dissemination of its results.
Details of the research and results will be shared in a symposium and summer school in 2016. Prior to this, users will be able familiarize themselves with the onboard system through access to a web-based demonstration and emulation system.
This text reflects only the author’s views and the Union is not liable for any use that may be made of the information contained therein.
About Ramon Chip, Ltd.
RAMON CHIPS Ltd. is a fabless semiconductor company focused on developing unique Radiation Hardened VLSI /ASIC solutions for space applications. Their silicon proven RadSafe™ technology provides extreme high immunity to all space radiation effects in LEO, GEO and outer space missions, while maintaining high density, high performance and low power. The company has expertise in designing digital and analog radiation-hardened integrated circuits from specifications, in synthesis of functions and algorithms into robust radiation-tolerant cores and in converting FPGA designs into radiation-hardened ASICs. Named in memory of the late Col. Ilan Ramon, Israel's first astronaut who perished in the Columbia space shuttle re-entry accident in 2003, the company was founded in 2004 and is based in Israel. For additional information contact: firstname.lastname@example.org.
About Presto Engineering, Inc.
Presto Engineering provides comprehensive semiconductor product engineering solutions to IDM, fabless and electronics companies, contributing to improving ramp time, margins and quality of new products.
Presto Engineering is a recognized expert in the development of test solutions for component characterization and production. This expertise, combined with state-of-the-art ESD, reliability and failure analysis capabilities, produces a competitive advantage for our customers in optimizing end-product performance and accelerating time to market. We offer turn-key solutions from customer tape-out to delivery of finished goods to end-customer(s), including assembly, test, qualification, industrialization, and production sustaining activities.
Presto Engineering is headquartered in San Jose, California, and has operations in Europe and Israel. Additional information is available on the company’s website at www.presto-eng.com.