SINGAPORE--(BUSINESS WIRE)--Heptagon (www.hptg.com), a leading provider of intelligent micro systems for smart devices, today announced the general availability of its TrueD H2 array camera, the first in a series of advanced 3D imaging and depth sensing micro systems that Heptagon is introducing to the market. The TrueD H2 camera has one of the smallest form factors currently available for mass production.
Heptagon’s TrueD H2 array camera captures additional short-range depth information for gesture and user recognition, background removal, and enhanced imaging. Its key features are typically used for front-facing smart device cameras, but can also add value as an assisting camera to the smart device’s primary camera. The TrueD H2 array camera is ultra-miniature, the result of integration of its image sensor, module, optics, algorithms, and software. It is ideal for devices where size is a key differentiator, or for emerging applications such as 3D or immersive mobile video games, ‘augmented reality’, and even the explosion of ‘selfies’ with more sophisticated image manipulation and enhanced photography.
“Smart device innovations continue at warp speed, transforming the ways people interact with their devices. So, our challenge is to deliver micro imaging and sensing systems for these devices with enhanced capabilities, ultra high quality, ever-shrinking form factor and optimal cost,” said Rene Kromhof, Heptagon’s vice president of sales and marketing. “With the TrueD H2 array camera, we have proven our ability to innovate rapidly and produce high-volume, market-ready solutions that meet customers’ unique and demanding requirements.”
In addition to enhanced depth mapping, exceptionally low z-height for ultra-slim device design, superior color fidelity and low power consumption, the TrueD H2 array camera leverages unique, patented focus correction packaging (FCP) that accelerates low cost, high quality production. FCP enables high-throughput, low cycle time module assembly, without the need for active alignment systems or barrel-mount solutions. In addition to faster line production, FCP also drives higher yield and therefore lower overall unit costs – important benefits for rapid, high volume manufacturing of smart devices.
“We are extremely proud that our TrueD H2 array camera has already moved from development stage into volume production,” said S.C. Leong, Heptagon’s chief operating officer. “We appreciate the incredible efforts our team and our partners have put into achieving this milestone.”
The TrueD H2 2x2 array camera is the result of more than three years of development efforts from Heptagon. The 2014-15 pipeline will include new array formats, lens enhancements, higher resolution, and additional sensing system innovations. In addition, Heptagon has recently released products that help to radically reduce the height and total footprint of smart devices, including VCSEL based illuminators and some of the world’s smallest IR emitters.
Heptagon provides intelligent micro imaging, sensing and light systems for smart devices. Our industry leadership results from a unique combination of wafer-level integration, pragmatic innovation, total supply chain control, a culture of integrity, and more than 20 years of delivering breakthrough technologies to leading OEMs. Backed by world-class investors, Heptagon’s research and development teams are located in Zurich, Switzerland; development and manufacturing are in Singapore; customer support services are in Shenzen, China; and business development, software engineering and the office of the CTO are in Mountain View, CA. To learn more, visit www.hptg.com.