Three New Advanced Packaging Products from Shin-Etsu MicroSi, Inc. Address Demands of Flip Chip and Wafer-Level Packaging Markets

Dielectric Films and Photoresist Products Are Easily Integrated Into Advanced Packaging Processes and Pass Rigorous Reliability Demands

Dense Array of 50 micron Copper Pillars, after SIPR-7120 Series Resist Strip (Photo: Business Wire)

PHOENIX--()--Shin-Etsu MicroSi, Inc. announces the release of new products for the flip chip and wafer-level packaging markets. These products include two new families of permanent dielectric films, the SINRTM-Series and the SPSTM-Series, as well as the next-generation photoresist in their current SIPRTM-7120 Series.

Photo-definable Dielectric Films

The first new product line, the SINRTM-Series, based on novel siloxane polymer chemistry, is a family of photo-definable, permanent dielectric films that can be cured at 180ºC or lower. Products in this family have been optimized for redistribution wiring (RDL), repassivation, stress buffer, and wafer-level bonding applications. Numerous advanced packaging customers have recently completed testing and report complete success in passing rigorous reliability demands.

The second new product line, the SPSTM-Series, is a family of photo-definable, permanent dielectric films based on poly (imide silicone) chemistry. These new materials are TMAH-developable and are easily integrated into existing processing lines that use conventional developers.

Next-generation Photoresist

The third new product is SIPRTM-7126, the next-generation product in our successful SIPRTM-7120 Series. SIPRTM-7126 is a positive tone, chemically amplified, TMAH-developable photoresist, capable of up to 100um film thickness in a single coat. Developed for conventional solder bump or copper pillar applications, the product has been optimized to withstand very aggressive plating chemistries without losing integrity. This resist is also easily removed after plating.

END

About Shin-Etsu MicroSi: Shin-Etsu Chemical Co., Ltd. purchased MicroSi in 1989 and expanded its product lines, which include photolithography products (photoresists, pellicles, quartz substrates for photomasks, and contrast enhancement materials), semiconductor packaging products (thermal management products, device packaging products, and silicone polyimides), and high-performance flexible copper laminates used in the production of flexible circuits. Tokyo based Shin-Etsu Chemical Co. Ltd. is the worlds largest supplier of semiconductor materials, semiconductor silicon, synthetic quartz, PVC, and is a major producer of materials including silicones, methylcellulose and rare earths. Contact Shin-Etsu MicroSi at (888) MicroSi or visit them at http://www.microsi.com.

Contacts

Shin-Etsu MicroSi
Ed Nichols, 480-893-8898
enichols@microsi.com
or
Bruce Kirkpatrick, 925-244-9100
brucekirk@kirk-com.com

Contacts

Shin-Etsu MicroSi
Ed Nichols, 480-893-8898
enichols@microsi.com
or
Bruce Kirkpatrick, 925-244-9100
brucekirk@kirk-com.com