Applied Materials Delivers High-Performance TSV Etch with Innovative Silvia™ System

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The Applied Centura Silvia Etch system enables high-performance, low-cost through-silicon via (TSV) applications. (Photo: Business Wire)
The Applied Centura Silvia Etch system enables high-performance, low-cost through-silicon via (TSV) applications. (Photo: Business Wire)Photo

The Applied Centura Silvia Etch system enables high-performance, low-cost through-silicon via (TSV) applications. (Photo: Business Wire)

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