Applied Materials Introduces Aerial Imaging to the Wafer Fab for Boosting Lithography Productivity

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The Aera2 platform's IntenCD technology can improve wafer critical dimension uniformity by more than 20%. (Photo: Business Wire)
The Aera2 platform's IntenCD technology can improve wafer critical dimension uniformity by more than 20%. (Photo: Business Wire)

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The Aera2 platform's IntenCD technology can improve wafer critical dimension uniformity by more than 20%. (Photo: Business Wire)
The Aera2 platform's IntenCD technology can improve wafer critical dimension uniformity by more than 20%. (Photo: Business Wire)Photo

The Aera2 platform's IntenCD technology can improve wafer critical dimension uniformity by more than 20%. (Photo: Business Wire)

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