Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards

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MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)
MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

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MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)
MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)Graphic

MICROFILL(TM) EVF Copper Via Fill provides enhanced via filling at low surface thickness. (Graphic: Dow Electronic Materials)

http://www.businesswire.com/multimedia/home/20091026006074/en/1871252/Dow-Electronic-Materials-Introduces-Metallization-Imaging-Products
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