Tegal Receives Repeat PVD Production System Order From US Customer
Global Leader in Power Management Devices Selects Endeavor AT for Production of Advanced Devices on Ultra-Thin Wafers
SAN JOSE, Calif.--(BUSINESS WIRE)--Tegal Corporation (Nasdaq:TGAL), a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits and nanotechnology devices, today announced that it had received a repeat order for its Endeavor AT™ PVD cluster tool from a U.S.-based global leader in power management device manufacturing. The new Endeavor system will be shipped to a fab in the U.S. and will be used in the production of next-generation IGBTs and power MOSFET ICs. Such power management devices are built into servers, computers, cars, satellites and home appliances.
“The Endeavor PVD system has proven capability to deposit high purity, stress-free metal films on unsupported wafers as thin as 65 microns with high handling yield. This unique capability allows low cost manufacturing of the most advanced power management devices in the industry.”
“The Endeavor PVD System was selected on the basis of our proven track record in high volume manufacturing at this global leader in power management devices, the most advanced when it comes to device production on ultra-thin wafers,” said Thomas Mika, President and CEO of Tegal Corporation. “The Endeavor PVD system has proven capability to deposit high purity, stress-free metal films on unsupported wafers as thin as 65 microns with high handling yield. This unique capability allows low cost manufacturing of the most advanced power management devices in the industry.”
“Tegal has continued to offer a high level of support needed for high-volume IC production,” said Murali Narasimhan, Vice President of Marketing at Tegal. “Our customer is focused on enabling technologies in power management for products that work smarter, run cooler, and raise productivity through innovative MOSFET technology. Backside Metallization with good adhesion and Ohmic contact to the current drain of a power MOSFET is essential for low on-resistance of these devices. Modulation in film stress through the magnetron technology of the Endeavor’s S-gun based PVD reactor enables ultra-thin wafers to undergo the PVD process without cracking.”
The Endeavor AT system is a state-of the-art, ultra-high vacuum PVD cluster tool and is used in production fabs to deposit consistent, high purity films with low to zero stress values in an extremely clean process environment. These films are widely used in under-bump metallization, advanced packaging, power devices, photo masks (including EUV), high-brightness light emitting diodes (HB-LEDs), and electro-acoustic devices for FBARs and MEMS. The Endeavor AT has an easy-to-use GUI, SECS/GEM communication, reliable low-contact wafer handling and flexible wafer shape and size capability, that makes it ideal for ultra-clean production environments for both front-side and back-side applications. Optional damage-free soft-etch modules and a variety of RF magnetrons are available to sputter many different dielectric and conductive films used in semiconductor and other electronic device production.
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Except for historical information, matters discussed in this news release contain forward-looking statements within the meaning of Section 27A of the Securities Act and Section 21E of the Exchange Act. Forward-looking statements, which are based on assumptions and describe our future plans, strategies and expectations, are generally identifiable by the use of the words "anticipate," "believe," "estimate," "expect," "intend," "project" or similar expressions. These forward-looking statements are subject to risks, uncertainties and assumptions about the Company including, but not limited to industry conditions, economic conditions, acceptance of new technologies and market acceptance of the Company's products and services. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by the cautionary statements in this paragraph. For a further discussion of these risks and uncertainties, please refer to the Company's periodic filings with the Securities and Exchange Commission.
Tegal provides process and equipment solutions to leading edge suppliers of advanced semiconductor and nanotechnology devices. Incorporating unique, patented etch and deposition technologies, Tegal’s system solutions are backed by over 35 years of advanced development and over 100 patents. Some examples of devices enabled by Tegal technology are energy efficient memories found in portable computers, cellphones, PDAs and RFID applications; megapixel imaging chips used in digital and cellphone cameras; power amplifiers for portable handsets and wireless networking gear; and MEMS devices like accelerometers for automotive airbags, microfluidic control devices for ink jet printers; and laboratory-on-a-chip medical test kits.
For more information about Tegal Corporation, visit: www.tegal.com.