Canadian Nano Fab Selects SUSS Wafer Bonder
MUNICH, Germany--(BUSINESS WIRE)--SUSS MicroTec. (FWB:SMH) (GER:SMH), a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets announced today that the University of Alberta’s NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.
“We are pleased that they have chosen the ELAN bonder to support process advances at the R&D level. In addition, researchers using the NanoFab will benefit from the ability to easily transfer technology developed on the ELAN bonder to any SUSS production wafer bonding system.”
The NanoFab is an open access micro and nano fabrication facility which is currently being used by over 130 research groups from the University of Alberta, other Canadian Universities and industry. The SUSS ELAN CB6L manual bonder will be used in nanotechnology research, pressure sensors for the oil industry, and RF MEMS switches for wireless applications.
“The micro and nano fabrication equipment in our facility is virtually unequaled in Canada,” says Dr. Ken Westra, Director of the NanoFab, which boasts an equipment set worth more than $20 million. Westra has over 20 years experience in MEMS fabrication, thin films, and microfabrication in both industry and academia. “We are pleased to invest in the SUSS bonder as part of our strategy to provide the latest MEMS process technologies to our research partners,” he said.
“The University of Alberta is one of the best microfabrication research labs in North America,” says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA. “We are pleased that they have chosen the ELAN bonder to support process advances at the R&D level. In addition, researchers using the NanoFab will benefit from the ability to easily transfer technology developed on the ELAN bonder to any SUSS production wafer bonding system.”
The ELAN CB6L manual wafer bonder is designed specifically for research, development, and pre-production wafer bonding markets. It has the same core technology as the SUSS fully automated bonders - including precise temperature and force control during bonding, as well as computer controlled wafer processing - to ensure high-accuracy post bond alignment. Based on field-proven wafer bonding technology and supported by world-renown SUSS engineering and applications expertise, the ELAN is well suited for MEMS, optoelectronic, advanced packaging, and SOI applications.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit www.suss.com.
About The University of Alberta NanoFab:
The NanoFab is an open access micro and nano fabrication facility for the university community, located in Edmonton, Alberta. Open access means the facility is open to any university research group. The facility is located in the ECERF Building at the University of Alberta. The equipment list, currently valued at over $20 million, spans deposition, lithography, wet and plasma etching, and many other specialized tools. Unique capabilities included: Deep Silicon RIE, Nano-scale lithography and Micro Embossing of plastic pieces.
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