Sela Launches New Xact™ System for Semiconductor Engineering and Failure Analysis with Disruptive AIM™ Technology
Breakthrough Twin Beam Technology Enables Dedicated TEM and STEM Sample Preparation with More Artifact Free Sample Clarity and Precise End Point Detection
SUNNYVALE, Calif.--(BUSINESS WIRE)--SELA, a leading global supplier of cutting-edge engineering and failure analysis tools for the semiconductor industry, today releases the Xact, the first TEM sample preparation system using the disruptive new AIMTM (Adaptive Ion Milling) technology. Delivering excellent sample quality, significantly reduced turnaround times and enhanced productivity, SELA's newest system in its suite of sample preparation tools introduces a twin-beam solution uniquely configured for artifact-free sample clarity and precise end-point detection.
“The Xact addresses engineering and FA problems linked to the semiconductor and nanotechnology industry roadmap for at least the next two to three generations”
AIM reduces sample widths to below 50 nanometers over a large area with high precision, artifact free (wedge-like) quality, high throughput, and low COO. It was developed to overcome the limitations of FIB technology in regards to artifacts, size of selected area, lamella thickness and productivity.
A key feature of the AIM technology is a versatile ion gun assembly with controllable energy for aggressive milling but also capable of gentle milling and a controllable dynamic beam that can impact a specimen at a multitude of angles. The Xact also incorporates a SEM and STEM unit that facilitates unique automated, in-line, accurate end-point detection. The system incorporates a 5-axes positioning and micro-positioning manipulator that is used for loading/unloading, alignment, calibration and movement of the sample holder. An optimized air lock allows for rapid sample loading and vacuum readiness. The Xact is recipe driven for accuracy and ease of use.
“The Xact addresses engineering and FA problems linked to the semiconductor and nanotechnology industry roadmap for at least the next two to three generations,” commented Colin Smith, Sela CEO. “Our AIM technology is incorporated in a twin beam system engineered specifically for sample preparation. Sela has a history of innovation with award winning tools and AIM technology is the logical extension to that tradition by overcoming known limitations of FIB and delivering in the Xact tool a complete and comprehensive solution for the TEM and STEM community.”
Sela is already working on customer samples from around the world and is processing a new tool order for delivery within the next quarter. Xact was formally launched during ISTFA this week in Austin, Texas.
Gentle broad ion milling has traditionally been an accepted method of material removal to obtain samples of high quality with negligible artifacts. However, this technique could not be applied effectively for sample preparation because it could not fulfill the essential requirements of precision and productivity. It was therefore relegated to the function of touch-up of FIB or mechanically polished lamella or preparation of non site-specific specimens where throughput was not an issue.
SELA has overcome these drawbacks to offer a complete and comprehensive solution for sample preparation, thereby satisfying the ever-demanding needs of microanalysis.
SELA was ideally positioned to contemplate such innovation. It has established itself as the pre-eminent supplier of sample preparation solutions; its MicrocleavingTM technology has set the standard for precision high quality SEM sample preparation, and its EM2 system with the cryo-cooled dry sawing technology has enhanced the productivity of TEM sample pre-preparation. This latter innovation was viewed at SELA as a precursor to a full TEM sample preparation solution that would overcome the limitations of FIB and other preparation techniques.
About Sela: Sela, Ltd., founded in 1992, is a provider of a suite of cutting-edge failure analysis tools for the semiconductor industry including automated SEM (scanning electron microscope) and TEM (transmission electron microscope) sample preparation equipment. Sela’s proprietary Microcleaving technology and the newly introduced AIM (Adaptive Ion Milling) technology set the standard for high quality, automated engineering and failure analysis sample preparation. Over 250 Sela systems are installed at fabs, equipment and material suppliers and research institutes globally. For more information, please see www.sela.com.