Xradia Announces New X-ray Solutions for Advanced Semiconductor Packaging
"These system sales validate the importance of high-resolution x-ray tomography as a critical new analytical tool for semiconductor manufacturing," said Dr. Wenbing Yun, founder and President of Xradia. "3D x-ray microscopy enables the non-destructive investigation of design features or process defects, thereby lowering development costs and speeding time to market," said Yun. "The ROI of Xradia's new x-ray microscope system was evident from the very first sample images," said My Nguyen, senior researcher at Altera Corporation, one of the new system customers. "We are able to image features of interest not otherwise observable with other techniques. No sample prep means enormous cost savings and fast turn around time," said Nguyen.
“The ROI of Xradia's new x-ray microscope system was evident from the very first sample images”
High resolution 3D x-ray tomography provides critical new imaging capability for semiconductor packaging, including C4 ball grid arrays, stacked die, solder bumps and packaging interconnects. Defects such as solder non-wet, cracks, voids, delamination, opens and shorts are readily imaged. New applications are also emerging for RoHS lead-free development and vias in ceramic packaging. Xradia also manufactures microscope systems with sub 50nm resolution for chip and die-level applications.
About Xradia, Inc.
Xradia, Inc. is a privately held company established in 2000 to commercialize high-resolution x-ray microscopes for nondestructive inspection and nano-scale imaging. Initially targeted at failure analysis in the semiconductor IC industry, subsequent developments have led to a suite of commercial x-ray imaging products that have permitted expansion into markets that include metrology in semiconductor IC production, scientific equipment, biomedical research and nanotechnology development.