SUSS Wafer Bonding Equipment Selected for Use in Purdue University's Birck Nanotechnology Center
Purdue dedicated their new modernistic 187,000 square foot Birck Nanotechnology Center building on October 8, with the goal of positioning their institution as a leader in nanotechnology studies. This facility provides state-of-the-art laboratory environments and scientific equipment for nanoscale research that will be used by over 130 faculty and their students from 27 departments.
“We are proud to be a part of the further education and exploration into the nanotechnology field with the sale of these tools to Purdue University.”
"We are proud to be a part of the further education and exploration into the nanotechnology field with the sale of these tools to Purdue University."; said Michael Kipp, General Manager for the Substrate Bonder Division at SUSS MicroTec.
SUSS wafer bonder equipment was selected by Purdue to provide the necessary capabilities to further their research into wafer bonding applications in the field of nanotechnology. The SB6e is capable of up to 1micron post bond alignment and with its precisely controlled bond chamber atmosphere allows for superior performance and yields. The MA/BA6 tool is a high precision front to backside alignment tool. Additionally, the BA6 can be configured to allow room temperature direct (fusion) bonding to be achieved with post bond alignment accuracies of 0.5 microns.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit www.suss.com.
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