Tessera Partners With University of Alaska Fairbanks to Develop World-Class Microelectronics Center; Chip-Scale Packaging Capability Brings New Educational and Business Opportunities to University of Alaska Fairbanks
Leveraging Tessera's expertise in semiconductor packaging, OEM's microelectronics center enables UAF to provide packaging and assembly services for a variety of semiconductor devices, including EEPROM, DRAM and Flash memory chips. These semiconductor devices are widely used in defense, medical, wireless, consumer and computing electronics to meet next-generation miniaturization, performance and reliability requirements. With the CSP line and a Tessera license in place, UAF is now capable of serving as a resource for regional enterprise development and government projects that require reliable, industry-proven semiconductor packaging capabilities.
“We look forward to continuing our relationship with UAF to help catalyze high technology growth in Alaska.”
"Our work with the University of Alaska Fairbanks illustrates how collaborations between the country's engineering universities and leading technology suppliers can offer new capabilities to academic faculty, students, business and government agencies," said Nicholas Colella, senior vice president of the Product Miniaturization Division at Tessera. "We look forward to continuing our relationship with UAF to help catalyze high technology growth in Alaska."
"UAF's newly installed CSP assembly line together with the Tessera license has created an exciting opportunity for the university and the regional economy," said John Dickinson, chief financial officer, OEM, University of Alaska Fairbanks.
Pramod Karulkar, OEM's director, stated, "UAF can now help grow new technology companies and can offer students and faculty access to semiconductor packaging technology that can bring their products from concept to reality. Moving forward, we plan to continue evolving our CSP packaging capabilities to include multi-die stacking and other advanced packaging techniques."
UAF's Office of Electronic Miniaturization cleanroom facility is the only one of its kind in Alaska. The facility includes a fully qualified cleanroom that meets and exceeds Federal Standard 209E requirements. The cleanroom was designed as a Class 10,000 facility, but is currently operating at the Class 10 Level. The cleanroom provides a sustainable prototyping and low-volume capacity for miniaturizing electronic components and component systems for academic, government and commercial needs.
About Tessera Technologies, Inc.
Tessera Technologies, through its wholly-owned subsidiary Tessera, Inc., is a leading provider of miniaturization technologies for the electronics industry. Tessera enables new levels of miniaturization and performance by applying its unique expertise in the electrical, thermal and mechanical properties of materials and interconnect. As a result, Tessera's technologies are widely adopted in high-growth markets including consumer, computing, communications, medical and defense. Tessera's customers include the world's top semiconductor companies such as Intel, Samsung, Renesas, Toshiba and Texas Instruments. The company's stock is traded on the Nasdaq National Market under the symbol TSRA. Tessera is headquartered in San Jose, California. www.tessera.com.
About the University of Alaska Fairbanks' Office of Electronic Miniaturization
The University of Alaska Fairbanks' Office of Electronic Miniaturization addresses the ongoing demand for miniaturization of electronic components and electronic systems by utilizing a core technology called chip-scale packaging. Basic and advanced chip-scale packaging prototyping capabilities are housed within cleanroom facilities, providing a learning laboratory for scientific investigations and applications which can potentially benefit from miniaturization. This university facility is the only one of its kind in Alaska and is expected to be instrumental in creating new educational opportunities and high-tech jobs for Alaskans in the art and science of electronic miniaturization, and to provide sustainable prototyping and low-volume capacity for miniaturizing electronic components and component systems for government and commercial needs. www.silicontundra.org.
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected. Factors that might cause or contribute to such differences include, but are not limited to, fluctuations in Tessera's operating results due to the timing of new license agreements and royalties, Tessera's ability to protect its intellectual property and the risk of a decline in demand for semiconductor products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2004, and its Quarterly Report on Form 10-Q filed for the quarter ended June 30, 2005, include more information about factors that could affect the company's financial results.
Note: Tessera, MicroBGA and the Tessera logo are registered trademarks of Tessera, Inc. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.
Note: The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the University of Alaska Fairbanks.