SUSS MicroTec Receives Strategic Order for new Production Aligner with Submicron Overlay Accuracy
The newly developed MA200Compact represents SUSS MicroTec's next generation full-field lithography production platform. The MA200Compact is equipped with the novel, patent pending SUSS DirectAlign(R) function, that allows for an overlay accuracy down to 0.5 micron. This makes the MA200Compact the mask aligner with the highest precision available. The submicron alignment capability of the DirectAlign feature allows to employ cost-effective mask aligner technology for a variety of novel applications in the field of thick resists flip chip bumping, wafer level packaging, MEMS, nanotechnology and telecommunications devices. In addition the machine offers a new, flexible robot handler design and a minimal footprint.
“The market responds very favorably to our new MA200Compact. The order from Japan is the fifth consecutive order for this new production aligner this year”
"The market responds very favorably to our new MA200Compact. The order from Japan is the fifth consecutive order for this new production aligner this year", said Rolf Wolf, Managing Director of SUSS MicroTec's Lithography Division. "With this sophisticated, highly innovative mask aligner we once again deepen our commitment to bringing full field exposure technology into high-volume manufacturing environments and maintain our strong position as the world leading supplier of mask aligner technology."
With a simple layout and construction, mask aligners are less expensive than steppers, easier to operate and maintain and require less space in the cleanroom. This results in a lower cost of ownership, which is the main reason why SUSS mask aligners became the tool of choice, especially for MEMS production, advanced packaging and compound semiconductor applications.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the TecDax segment of the German Stock Exchange. For more information, please visit http://www.suss.com.