Applied Materials Redefines Chip Packaging Productivity with New
Charger PVD System
SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today introduced its Applied Charger™
UBM PVD system that defines a new standard in metal deposition
productivity and reliability for chip packaging. Specifically designed
for under-bump metallization (UBM), redistribution layer and CMOS image
sensor applications, the Charger system’s new linear architecture more
than doubles the wafer output of competing systems to deliver the
highest productivity available. In addition, proprietary Isani™
wafer treatment technology allows the Charger UBM system to process ten
times more wafers between servicing to enable best-of-breed uptime
performance and the lowest available per-wafer cost.
“By blending our proven PVD*
process technology with packaging-specific innovations, we’ve created a
highly productive, cost-efficient solution that is already churning out
wafers in high volume production at multiple customers around the world.”
“Packaging facilities need a fast, dependable metallization workhorse to
maximize wafer output and minimize the system redundancy burden imposed
by slower, less reliable alternatives,” said Steve Ghanayem, vice
president and general manager of Applied Materials’ Metal Deposition and
Front End Products Business Unit. “By blending our proven PVD*
process technology with packaging-specific innovations, we’ve created a
highly productive, cost-efficient solution that is already churning out
wafers in high volume production at multiple customers around the world.”
Key to the Charger platform’s high productivity is its streamlined
modular architecture that easily expands from three to five processing
stations to sequentially deposit multiple thin films while keeping the
wafer in an ultra-clean, ultra-high vacuum environment. Incoming wafers
are conditioned using novel Isani wafer treatment technology that
ensures a low-resistance, low-contaminant interface between the incoming
device and the metal films to be deposited while also delivering
excellent defect performance and greatly extended maintenance intervals.
Applied’s superior PVD reactor technology can tailor the properties of
each film layer for optimum device performance while the flexible
architecture enables extendibility to emerging three-dimensional
interconnect and packaging technologies.
The Charger UBM system builds on Applied’s two decades of leadership in
PVD metallization technology. Applied’s PVD systems are used by
virtually all advanced manufacturers around the globe for fabricating
chips. For more information, visit www.appliedmaterials.com/products/charger_4.html.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in
Nanomanufacturing Technology™ solutions with a broad portfolio of
innovative equipment, service and software products for the fabrication
of semiconductor chips, flat panel displays, solar photovoltaic cells,
flexible electronics and energy efficient glass. At Applied Materials,
we apply Nanomanufacturing Technology to improve the way people live.
Learn more at www.appliedmaterials.com.
* PVD = physical vapor deposition
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