Applied Materials’ New eHARP System
Extends Production-Proven STI Gap-Fill Technology to 32nm and Beyond
SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its Applied Producer®
eHARP™
system, extending the production-proven HARP SACVD®1
gap-fill technology for critical STI2 device
structures to 32nm and beyond. The eHARP process delivers void-free
films to fill <30nm, >12:1
aspect ratio features – essential requirements
for the fabrication of advanced memory and logic devices. Featuring
proprietary new process innovations, the eHARP system’s
robust, high-density, strain-inducing films enable the scaling of
conventional planar and emerging 3-D device structures.
“Applied has led the industry in providing the
most advanced HDP-CVD3 and SACVD gap-fill
technologies over the last 14 years to meet customers’
most stringent process demands,” said Bill
McClintock, vice president and general manager of Applied’s
Dielectric Systems and CMP business unit. “With
the Producer eHARP system, Applied offers customers an STI gap-fill
roadmap beyond 32nm without significant changes to their process flow.
Customers are very excited about the eHARP system’s
capabilities, including major device manufacturers who have selected the
eHARP system as tool of record for development and production in
advanced logic and memory.”
The Producer eHARP technology offers the lowest overall cost-per-wafer
compared to non-CVD gap-fill technologies. Virtually carbon-free, the
eHARP film requires no protective liners or capping layers, easily
integrates with conventional CMP processes and provides reliable, robust
device isolation. In addition, the eHARP system’s
proven process chemistries do not generate hazardous liquid byproducts
that would necessitate specialized chemical disposal.
The eHARP process is available on Applied’s
acclaimed Producer platform, which is used by virtually every chip
manufacturer for advanced applications including etch, low k deposition,
strain engineering, litho-enabling films, PECVD4
and SACVD. More than 500 Producer systems have been shipped to customers
for SACVD applications, any of which can be upgraded to run the eHARP
process. For more information, visit http://appliedmaterials.com/products/eharp_4.html.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in
Nanomanufacturing Technology™ solutions with
a broad portfolio of innovative equipment, service and software products
for the fabrication of semiconductor chips, flat panel displays, solar
photovoltaic cells, flexible electronics and energy efficient glass. At
Applied Materials, we apply Nanomanufacturing Technology to improve the
way people live. Learn more at www.appliedmaterials.com.
1 SACVD = sub-atmospheric chemical
vapor deposition
2 STI = shallow trench isolation
3 HDP-CVD = high density plasma CVD
4 PECVD = plasma enhanced CVD
