Event Advisory: Distinguished Panel to Explore New Dimensions in
Scaling at Applied Materials Symposium
International Interconnect Technology Conference
SANTA CLARA, Calif.--(BUSINESS WIRE)--Progress in advanced semiconductor technology depends on the industry’s
ability to continuously change and reinvent itself. On June 2nd
Applied Materials, Inc. will host an evening of presentations and
discussion exploring the strategies needed to scale device performance,
functionality and cost for the next decade. A panel of industry
executives will share their perspectives on advancements in lithography
and patterning materials, new design layouts, 3D integration and novel
packaging schemes that are expected to drive greater device densities
and process efficiencies.
Titled “New Dimensions to Moore’s
Law,” this important event will take place in
conjunction with the prestigious International Interconnect Technology
Conference (IITC) in Burlingame, CA.
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Panel:
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Dan Hutcheson, VLSI Research
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Chris Malachowsky, nVidia Corporation
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Klaus Schuegraf, SanDisk Corporation
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Scott Becker, Tela Innovations
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Tom St. Dennis, Applied Materials
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Where:
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The Hyatt Regency at San Francisco Airport,
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1333 Bayshore Highway, Burlingame, CA 94010
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When:
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Monday, June 2nd, 2008
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Schedule:
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5:00pm
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Registration and Reception
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6:15pm
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Panel and Q&A
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For event registration, please visit www.appliedmaterials.com/2008_IITC/
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in
Nanomanufacturing Technology™ solutions with a
broad portfolio of innovative equipment, service and software products
for the fabrication of semiconductor chips, flat panel displays, solar
photovoltaic cells, flexible electronics and energy efficient glass. At
Applied Materials, we apply Nanomanufacturing Technology to improve the
way people live. Learn more at www.appliedmaterials.com.
