SOKUDO Introduces 200wph RF^3T Coat/Develop System

KYOTO, Japan--(BUSINESS WIRE)--SOKUDO Co., Ltd. today announced its new RF^3T system, the company’s highest productivity, lowest cost-of-ownership (CoO) coat/develop track system targeted for the full range of lithography applications. This system significantly extends the capabilities of SOKUDO’s established RF³ platform to achieve world-class 200 wafer per hour (wph) throughput, keeping pace with the fastest lithography scanners while maintaining process transparency.

To achieve a 10% throughput improvement over the RF^3S, the RF^3T system features additional parallel process modules and higher efficiency wafer transport. The develop cell has been reconfigured for eight develop modules in the same platform footprint to provide 60% higher develop and rinse process capability than the previous system. A novel wafer coating dispense system significantly reduces chemical consumption, the largest contributor to track operating cost. Combined, these features provide lower CoO and higher process performance for lithography applications.

“The new RF^3T builds on our RF³ system technology enhancements to provide customers with higher productivity on an established platform,” said Takashige Suetake, CEO of SOKUDO. “With the RF^3T system’s eight develop module capability, we have further differentiated our product and improved customer value.”

The RF^3T coat/develop track will be introduced at Semicon Japan 2007, December 5-7, at the Makuhari Messe in Chiba, Japan.

SOKUDO Co., Ltd.

SOKUDO Co., Ltd. (Headquarters: Kyoto, Japan) is a joint venture company owned by Dainippon Screen Mfg. Co., Ltd. and Applied Materials, Inc. SOKUDO was established on July 3, 2006 for the development, manufacturing, sales and service of advanced coat/develop track equipment for semiconductor production. Additional information on SOKUDO can be found at www.sokudo.com.