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The breakthrough Applied Endura CuBS II system enables PVD copper
barrier/seed deposition at 45nm and beyond.
(Photo: Business Wire)

The breakthrough Applied Endura CuBS II system enables PVD copper barrier/seed deposition at 45nm and beyond. (Photo: Business Wire)

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http://www.businesswire.com/multimedia/appliedmaterials/20041130005811/en/1137512

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