Rudolph Technologies to Participate in the Sixth Annual CEO Investor Summit 2014
Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2014 in San Francisco
FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced that the Company’s management will participate in the Sixth Annual CEO Investor Summit 2014, Wednesday July 9, 2014 in San Francisco, California.
About The 6th Annual CEO Summit
The CEO Summit is an accredited investor and publishing research analyst event that is held concurrently with SEMICON® West and Intersolar 2014 in San Francisco. The event is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration.
The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is June 27, 2014.
While held concurrently with SEMICON West and Intersolar 2014, the event is not affiliated with the show.
RSVP Contacts for 6th Annual CEO Summit 2014
To RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.
Laura J. Guerrant-Oiye
Phone: (808) 882-1467
Claire E. McAdams
Headgate Partners LLC
Phone: (530) 265-9899
About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.