Teradyne
Products   |   Contact Us   |   Support & Training   |   Investors   |   Careers   |   Advanced Search   |   About Teradyne
Press 
Releases
Archived Press Releases - Year 2011 | 2010 | 2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003 | 2002 | 2001 | 2000 
Receive news via email 
 

National IC Design Industrialization Base, Hangzhou

Purchases the Teradyne J750

SHANGHAI, China--()--Teradyne, Inc. (NYSE:TER) announced the National IC Design Industrialization Base, Hangzhou (HICC) has purchased the J750 test system to meet the device test demands of local IC design houses in the ZheJiang Province. Selection was based on Teradynes large and well established installed base of test systems that enables IC design houses to speed the load time of high volume production in local or overseas testing and packaging facilities. Strong global customer service and easy-to-learn software were also key elements in the selection of the J750.

“Their central location combined with the high volume production capability of the J750 is a powerful combination for their customers. We are very pleased to serve HICC as well as China’s IC design houses.”

The Teradyne(R) J750 is the perfect fit for meeting local IC design house test demands, said Mr. Qi Ma, Senior Vice President, HICC. The IG-XL(TM) software environment on the J750 is a common software environment with the Teradyne FLEX(TM) Test Platform. This software commonality enables local design houses to meet current demand and have a robust roadmap of future high end product testing. High praise of the J750 by local full-scale IC design houses also confirmed our choice to purchase the J750.

HICC is located in Hangzhou, the capital of ZheJiang Province. The geographical location is advantageous for HICC to best serve the IC design houses in the region, said SI Wei, Vice President, Semiconductor Test Field Operations, Greater China Region, Teradyne. Their central location combined with the high volume production capability of the J750 is a powerful combination for their customers. We are very pleased to serve HICC as well as Chinas IC design houses.

About the J750

The Teradyne J750 high-throughput parallel test capability provides as high as 95% device test efficiency. The zero footprint system delivers up to 1,024 I/O channels contained in a test head, and offers a suite of options, including the Converter Test Option, Memory Test Option, Redundancy Analysis, and Mixed Signal Option, that broaden the range of testing capabilities. The system also features IG-XL test software that combines the power and performance of the latest PC technology and Windows NT operating system with the familiarity of standard Windows productivity tools, such as Microsoft Excel and Visual Basic. The J750s small footprint and high parallel test throughput provide the most economical approach to testing complex VLSI devices with embedded memory and analog cells.

About FLEX

The Teradyne FLEX Test Platform advances test technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SoC) and System-In-Package (SiP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX(TM) open system architecture complements the FLEX Platforms broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

About National IC Design Industrialization Base HICC

Approved by Chinas Ministry of Science and Technology, National IC Design Industrialization Base Hangzhou was set up on December 7, 2001 together with six other national IC design industrialization bases in the Country. The comprehensive projects of base development is focused on National High Technology Industrial Development Zone, actively works on establishment of a development environment, public technology platform and talent training center. The public technology platform composed with EDA tools, verification and testing, and training platform is the core of base development. It also is the first technical innovation platform of ZheJiang province which is the key components of ZheJiang IC design public technical platform. For more information, please visit http://www.hicc.org.cn.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2005, Teradyne had sales of $1.08 billion, and currently employs about 4,000 people worldwide. For more information, visit www.teradyne.com.

Teradyne(R), IG-XL, FLEX and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc. in the US and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.

Contacts

Teradyne, Inc.
Cavlin Lin, 86.21.38424668
Asia Pacific Marketing
calvin.lin@teradyne.com

©Teradyne Inc. 1994-2011 All rights reserved.
Terms of Use | Privacy Statement | Site Index | Contact Us