Atheros Purchases Teradyne FLEX System for Quad-Site Production Device Test; Teradyne's Gen4 Microwave tests single-chip Personal Handyphone System device

BOSTON--(BUSINESS WIRE)--Oct. 13, 2005--Teradyne (NYSE:TER) announced that Atheros Communications, a leading developer of semiconductor system solutions for wireless communications products, has purchased a FLEX(TM) test system with a full range of Teradyne Gen4 Microwave instrumentation. The system will be used for production device test of Atheros' portfolio of RF System-on-a-Chip (RF SOC) devices, including the AR1900, the world's first single-chip cellular solution for Personal Handyphone System (PHS) handsets. In a competitive selection process, Teradyne was chosen based on the proven high throughput and test economics of the FLEX Platform and functional performance of the Gen4 Microwave instrumentation.

"The Teradyne FLEX system enables Atheros to implement quad-site testing for our single-chip wireless products," said Paul Franklin, Vice President of Operations for Atheros. "The FLEX system's high throughput enables us to achieve superior cost-of-test economics relative to any other ATE platform available on the market today. In addition, our subcontractors are demonstrating a preference for FLEX systems as they tool for future production capacity."

“Atheros continues to demonstrate their leadership and technical innovation in wireless communications products like the AR1900”

"Atheros continues to demonstrate their leadership and technical innovation in wireless communications products like the AR1900," said David Trounson, General Manager, Teradyne Semiconductor Test Wireless Business Unit. "Teradyne is very pleased that Atheros has chosen the FLEX Platform for production test, again validating that the FLEX architecture delivers the parallelism and cost-of-test required to deliver next-generation RF SOC devices to market."

About the FLEX Platform

The Teradyne FLEX Platform advances multiple technologies in a test architecture designed for high-efficiency, multi-site test. The Platform offers multiple systems so customers can optimize for performance, capacity and capital cost to achieve lower cost-of-test. FLEX Platform systems span test requirements from DFT and structural test to standard analog and mixed-signal to the latest high-integration System-on-a-Chip (SOC) and System-In-Package (SIP) devices for consumer, automotive, mass storage, wireless, and data communications applications. The FLEX Platform architecture delivers instrument synchronization and control in device clock time on a vector-by-vector basis, even in multiple time domains. A Universal Slot test head design allows easy reconfiguration for changing test needs. The IG-XL(TM) software operating system provides fast program development, including instant conversion from single to multi-site test. And, the OpenFLEX(TM) open system architecture complements the FLEX Platform's broad set of high-density instrumentation, allowing focused instruments to be added and further enhance system performance and test economics. To learn more about the FLEX Platform, visit http://www.teradyne.com/flex/.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5,700 people worldwide. For more information, visit www.teradyne.com. Teradyne(R), FLEX, IG-XL, and OpenFLEX are trademarks or registered trademarks of Teradyne, Inc.