Teradyne Connection Systems Provides Highest Density and Speed with Introduction of Ventura(TM) Connector; Robust SMT Design Leads Industry in Density and Speed

NASHUA, N.H.--(BUSINESS WIRE)--Sept. 20, 2005--Teradyne, Inc. (NYSE: TER) Connection Systems Division (TCS), the industry leader in high-performance connection systems, today announced the launch of its Ventura(TM) high-speed, high-density connector -- the fastest single-ended interconnect with the most signal pins per inch of any connector on the market.

Teradyne's Ventura connector features 178 real signals per inch (single-ended) and 93 differential signals per inch in its 14-row version. Using surface mount technology, the Ventura design reduces via effects and enables higher performance by replacing the standard compliant pin plated through hole with a 10 or 12 mil via.

“By applying advanced SMT technology to the Ventura connector, we can successfully put down arrays with up to 5,000 contacts with 100% success at the solder joints.”

"Performance is important, but mechanical connector robustness and ease of application are paramount," said Phil Stokoe, Teradyne Product Development Engineer. "By applying advanced SMT technology to the Ventura connector, we can successfully put down arrays with up to 5,000 contacts with 100% success at the solder joints."

The Ventura connector's unique platform allows it to be used in both 6.25 Gb/s single-ended, and 12 Gb/s differential applications. High-speed single-ended electrical performance features cross talk of less than five percent and insertion loss of less than 2 decibels (dB) at 6 GHz and less than 3 dB at 8 GHz. Differential insertion loss is less than 2 dB at 6 GHz and less than 3 dB at 10 GHz.

Other features include: connector backplane pins with a new stub-proof design and more than 2.5mm of wipe; a modular wafer design on both the backplane and daughtercard for maximum configurability; and a unique rear organizing stiffener for seamless integration of power and guidance modules. Ventura's routing design permits very high-density signal routing in both horizontal and vertical directions in the backplane, allowing backplane designers to reduce costly printed circuit board (PCB) layer counts while decreasing the time required to route the backplane.

The Ventura platform currently includes 14-row, 8-row, and 8-row right angle male versions.

Pricing and Availability

Teradyne's Ventura connector is now available at approximately $.18 - $.24 per mated signal line in full production volumes.

Demonstrations:

Teradyne will exhibit at DesignCon East, September 20-21 at the DCU Center in Worcester, Massachusetts.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment, and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5,900 people worldwide. For more information, visit www.teradyne.com. Teradyne(R) is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.

About Teradyne Connection Systems

Teradyne Connection Systems (TCS), a division of Teradyne, Inc., is the leader in high-performance connection systems, designing and manufacturing backplane systems, printed circuit boards and the industry's leading high-speed, high-density connectors. TCS helps OEMs solve system design challenges with integrated interconnect solutions for application in the networking, communications, storage, computer server, and medical equipment markets. For more information visit www.teradyne.com/tcs.