Teradyne's FLEX Test Platform Expands in Japan; New Small System Form Factor for Next-Generation Device Test Introduced

TOKYO--(BUSINESS WIRE)--Feb. 23, 2005--Teradyne, Inc. (NYSE:TER) announced several Japanese semiconductor manufacturers have purchased FLEX(TM) systems expanding Teradyne's position in the Japanese market. Manufacturers are testing mass-produced consumer devices and automotive devices with Teradyne's microFLEX(TM) that provides a zero-footprint system with a small system form factor. The microFLEX zero-footprint design reduces floor space requirements while incorporating all the features of the FLEX architecture in a single test head to achieve optimum test economics. FLEX is being selected as the next-generation production tester platform of choice based on its high parallel test efficiency.

"Teradyne's approach of providing one core tester architecture is impressive and the most significant progress in the industry to address cost of test," said Risto Puhakka, President, VLSI Research. "The FLEX core architecture includes a suite of technologies that enable optimized systems with a wide range of capability to adapt to customer needs. For example, with customers who are sensitive to floor space constraints, like in Japan, the size of microFLEX meets their space requirement while leveraging the proven capability of a core test architecture. Teradyne's core architecture approach changes everything - it's a new way to think about test."

“Teradyne's approach of providing one core tester architecture is impressive and the most significant progress in the industry to address cost of test”

"We designed a small system form factor for the FLEX Platform to address markets like automotive, where maximizing production floor space plays a critical role in overall test cost efficiency," said Doug Elder, Vice President and General Manager of Teradyne's Semiconductor Test Business Groups. "By extending the FLEX Platform, we are now able to provide our customers with a full-featured test system that provides all the advantages of the FLEX test architecture while addressing production floor space-sensitive needs. We look forward to continuing our support of Japanese semiconductor manufacturers in the growing consumer and automotive device markets."

About the FLEX Test Platform

Breaking the cost of test barrier with high-efficiency pure parallel multi-site test while meeting the demands of increasing complexity for an expanding range of devices, FLEX advances multiple test technologies. Its Tester-per-Device-Core(TM) architecture delivers a complete set of test resources to each device core, with instrument synchronization and control enabled by Sync-Link(TM) in the device clock time on a vector-by-vector basis. The Universal Slot test head and high-density instrumentation allow easy reconfiguration to changing test needs, and the OpenFLEX open system architecture complements Teradyne's FLEX instrument suite, allowing the addition of focused instruments to further enhance system performance and test economics. To learn more about FLEX, visit http://www.teradyne.com/flex/.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5900 people worldwide. For more information, visit www.teradyne.com. Teradyne(R) is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks or registered trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.