STATS ChipPAC Signs Volume Purchase Agreement with Teradyne for FLEX Test Systems

BOSTON--(BUSINESS WIRE)--Oct. 18, 2004--Teradyne, Inc. (NYSE:TER) announced today that STATS ChipPAC Ltd, a leading independent semiconductor test and advanced packaging service provider, has selected Teradyne's FLEX(TM) test system as a key platform for testing a wide range of devices for applications including communications, broadband and other consumer electronics. FLEX with microwave capability is already installed at STATS ChipPAC Test Services, the company's elite test facilities in San Diego and Milpitas, California, as well as STATS ChipPAC's high volume production facilities in Malaysia and Singapore.

"As an industry leader in outsourced testing, STATS ChipPAC strives to offer our customers test platforms that cover a broad range of devices while adapting to rapid technology changes," said Han Tiang Fong, Vice President of Test, STATS ChipPAC Ltd. "The strategic decision to work closely with Teradyne to significantly expand our FLEX installed base places STATS ChipPAC in the ready position to support a wide range of customer requirements today while being ready to serve new and emerging market demands."

“As an industry leader in outsourced testing, STATS ChipPAC strives to offer our customers test platforms that cover a broad range of devices while adapting to rapid technology changes”

Mark Kelley, General Manager, STATS ChipPAC Test Services continued, "Our focus is to provide customers with leading-edge test platforms and the support needed early in the product development cycle. Access to the FLEX in our San Diego and Milpitas test development facilities will help customers achieve their cost objectives and faster time-to-market. Customers are already signing up to use the FLEX for a wide range of requirements from conventional DFT and structural test to standard analog and complex mixed signal SOCs."

Doug Elder, General Manager, Semiconductor Test Business Groups, Teradyne, said, "The selection of FLEX as a future platform of choice by STATS ChipPAC is especially rewarding due to their strong commitment to offering innovative test and advanced packaging technologies to the marketplace. STATS ChipPAC is an industry leader with a commitment to R & D in the test and assembly services industry and Teradyne is very pleased with their decision to invest in the FLEX platform."

About FLEX

Breaking the cost of test barrier with high-efficiency multi-site test while meeting the demands of increasing complexity for an expanding range of devices, FLEX advances multiple test technologies. FLEX spans test requirements from conventional DFT and structural test to standard analog and mixed-signal to complex SOC. Its Tester-per-device-core architecture delivers a complete set of test resources to each device core, with instrument synchronization and control in device clock time on a vector-by-vector basis. The Universal Slot test head and high-density instrumentation allow easy reconfiguration to changing test needs, and the OpenFLEX open system architecture complements Teradyne's FLEX instrument suite, allowing the addition of focused instruments to further enhance system performance and test economics. To learn more about FLEX, visit http://www.teradyne.com/flex/.

About Teradyne

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2003, Teradyne had sales of $1.4 billion, and currently employs about 6,300 people worldwide. For more information, visit www.teradyne.com. Teradyne(R) is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks or registered trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.