Teradyne Connection Systems Joins UXPi - Unified 10 Gbps Physical-Layer Initiative

NASHUA, N.H.--(BUSINESS WIRE)--Feb. 23, 2004--

Participation Supports Teradyne's Delivery of High-Bandwidth Integrated System Solutions

“To achieve demanding data rates designers must look at the entire channel--from device to device--in addition to high-speed connector and backplane performance”

Teradyne, Inc. (NYSE:TER) Connection Systems Division (TCS), the industry leader in high-performance connection systems, today announced its membership in the Unified 10 Gbps Physical-layer Initiative (UXPi). Founded in October 2003 by Applied Micro Circuits Corp., IBM, Infineon AG, Texas Instruments and Xilinx, Inc., the goal of UXPi is to advocate a common 10Gbps physical-layer standard to simplify and accelerate the implementation of next generation 10Gbps systems. Teradyne has been an active member of the initiative since November of last year.

"To achieve demanding data rates designers must look at the entire channel--from device to device--in addition to high-speed connector and backplane performance," said Tom Pitten, Teradyne Connection Systems Engineering Manager. "We are pleased to be collaborating with the other members of this 10 Gb/s initiative in order to deliver a truly integrated and consistently reliable solution to the market."

The trend toward serial connectivity is being driven by the need to reduce system costs, simplify system design and provide scalability to meet new bandwidth requirements. UXPi members have been strong supporters of the work within the OIF (Optical Internetworking Forum) on the development of the CEI (Common Electrical Interface), which includes 6 Gbps and CEI 11 Gbps high-speed backplane standards. UXPi's vision is to see such development occur in parallel coordination in numerous standards venues. UXPi interfaces will provide a basis for future high-bandwidth connections in chip-to-chip, chip-to-optical module and backplane applications.

For additional information about UXPi visit www.uxpi.org.

About Teradyne, Inc.

Teradyne (NYSE:TER) is the world's largest supplier of Automatic Test Equipment, and a leading supplier of interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2003, Teradyne had sales of $ 1.4 billion, and currently employs about 6100 people worldwide. For more information, visit www.teradyne.com. Teradyne is a trademark of Teradyne, Inc. in the US and other countries.

About Teradyne Connection Systems

Teradyne Connection Systems (TCS), a division of Teradyne, Inc. (NYSE: TER), is the leader in high-performance connection systems, designing and manufacturing backplane systems, printed circuit boards and the industry's leading high-speed, high-density connectors. TCS helps OEMs solve system design challenges with integrated interconnect solutions for application in the networking, communications, storage, computer server, and medical equipment markets. For more information visit www.teradyne.com/tcs.

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Catherine Palmer

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Teradyne Connection Systems

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