Samsung Selects Teradyne for Smart Card Test

MUNICH, Germany--(BUSINESS WIRE)--May 12, 2003--Teradyne, Inc. (NYSE:TER) announced Samsung Electronics has selected the Integra J750 with Radio Frequency Identification Option (RFID) for contactless Smart Card test. Smart Cards are commonly found in public transportation, telephone, and health insurance cards, luggage tags, and a variety of other applications. Teradyne's J750 with RFID Option is the only solution available to support customers from characterization through design verification to high volume contactless smart card production.

"Over the years, Teradyne has provided numerous test solutions and local support for innovative Samsung products. The Samsung Smart Card is designed with a 'dual interface' where a contactless interface coexists with a contacted interface. Synchronization between digital channels and the RFID test instruments is critical - the J750 with RFID Option perfectly meets this requirement," said Roger Saylor, Teradyne Vice President of Asian Operations.

“The optimized 32-site parallel test architecture of the J750 achieves parallel test efficiencies of better than 95%, making it the ideal test solution for the high-volume smartcard market.”

The Integra J750 RFID Option provides 16 bi-directional RFID channels including transmitter and receiver path with synchronization and DSP units for device response demodulation. A single RFID board supports parallel test up to 16 sites and two boards can support up to 32 RFID devices in parallel.

"We saw the emerging growth in the contactless smartcard market and designed the RFID Option to deliver a complete suite of instruments for testing contactless as well as contacted smartcards on the Integra J750," said Martin Stadler, Consumer Business Unit Product Manager, Teradyne. "The optimized 32-site parallel test architecture of the J750 achieves parallel test efficiencies of better than 95%, making it the ideal test solution for the high-volume smartcard market."

About Integra J750

The J750's high-throughput test capability provides as high as 95% parallel test efficiency for up to 32 devices. The zero footprint system delivers up to 1,024 I/O channels contained in a test head, and offers a suite of options, including the Converter Test Option, Memory Test Option, Redundancy Analysis, and Mixed Signal Option, that broaden the range of testing capabilities. The system also features IG-XL test software that combines the power and performance of the latest PC technology and Windows 2000 operating system with the familiarity of standard Windows productivity tools, such as Microsoft Excel and Visual Basic. The J750's small footprint and high parallel test throughput provide the most economical approach to testing complex VLSI devices with embedded memory and analog cells.

About Teradyne

Teradyne (NYSE:TER) is the world's largest supplier of Automatic Test Equipment, and a leading supplier of interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2002, Teradyne had sales of $1.22 billion, and employed about 7000 people worldwide. For more information, visit www.teradyne.com.