Teradyne Connection Systems to Offer Deep Micro-Via Solutions; Extends Technology Lead with Large Format High Performance Circuits

NASHUA, N.H.--(BUSINESS WIRE)--Teradyne, Inc. (NYSE:TER) Connection Systems Division (TCS), a global supplier of high-speed, high-density connectors, high-performance circuits, and system integration and test services, today announced capabilities to provide deep micro-via technology for customers of high performance printed circuits (HPC).

As package density and technology drive the need for greater density on the printed circuit board, deep micro-via technology provides several benefits to printed circuit board designers. Teradyne's unique HDI capabilities include panel sizes up to 24" x 28" and micro-vias 3 layers deep or 3 mils in diameter. By providing circuit designers with less manufacturing barriers, system costs can be reduced, along with layer count, by as much as 20%.

“With increasing complexity, density, format size and thickness of HPC designs, it was a logical next step for Teradyne's exceptional large format production expertise. System architects can now review current and future platform decisions for significant cost optimization potential”

"With increasing complexity, density, format size and thickness of HPC designs, it was a logical next step for Teradyne's exceptional large format production expertise. System architects can now review current and future platform decisions for significant cost optimization potential," said Leigh Eichel, Teradyne Connection Systems HPC Marketing Manager. "We have worked with leading companies to redesign systems, removing entire circuits, cabling and harnesses which yields significant program cost savings."

Teradyne's large-format HDI capabilities include fine lines, thin cores, buried vias and micro vias. With printed circuit design, connector selection, signal integrity simulation, electrical test and applications engineering throughout the design process, Teradyne provides system solutions, which encompass the entire signal transmission path, to meet performance and cost requirements for demanding applications. For more information visit www.teradyne.com/hpc

About Teradyne, Inc.

Teradyne (NYSE:TER) is the world's largest supplier of Automatic Test Equipment, and is also a leading supplier of interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2002, Teradyne had sales of $1.22 billion, and employed about 7000 people worldwide. For more information, visit www.teradyne.com.

About Teradyne Connection Systems

Teradyne Connection Systems (TCS), a division of Boston-based Teradyne, Inc., provides total system solutions to industry leading OEMs, with high-performance circuits, high-speed, high-density connectors, multi-gigabit backplane assemblies and complete system integration and test services. Teradyne's components and electronic manufacturing services are used by manufacturers of communications and computing systems central to building networking infrastructure. For more information visit www.teradyne.com/tcs.