Teradyne`s NexLev-TM- High-Speed Parallel Board-to-Board Connector Achieves Telcordia GR-1217-CORE Compliance

NASHUA, N.H.--(BUSINESS WIRE)--Oct. 2, 2001--

Reinforces Connector's Reliability and High-Performance Capabilities

for Communications and Computing Systems

Teradyne, Inc. (NYSE: TER) Connection Systems Division (TCS), a leading manufacturer of high-speed/high-density interconnects, multi-gigabit custom backplanes, and high-performance systems integration and test, today announced its NexLev(TM) parallel board-to-board connector has met requirements of Telcordia GR-1217-CORE qualification. Telcordia requirements are recognized industry wide as an indicator of connector reliability and are used across a wide range of products, including equipment for networks, data processing, and computer storage.

As a parallel interconnect system, Teradyne's NexLev was tested for compliance with Telcordia's controlled environment requirements. To achieve this specific qualification, NexLev passed four test sequences which cover a range of inputs, such as vibration, physical shock, thermal aging, heat and humidity, sand and dust, and mixed flowing gas. These inputs mimic the typical worst case environments that the connector is expected to encounter over its life. The four tests simulate, over a relatively short period of time, what will happen over 10 to 20 years of actual field use.

"Telcordia compliance assures our customers that our connectors will perform to satisfaction over the expected life of their products," said Dan Murphy, VP of Sales and Application Engineering at TCS. "Meeting this reliability standard reinforces the high-performance capabilities of NexLev that make it a top choice among designers of telecom and datacom equipment."

Teradyne's NeXLev provides high density of up to 57 real signals per linear centimeter - 145 signals per inch - and is capable of handling data rates greater than 3.1 Gb/s. Offered in a range of heights from 10 to 30 mm, electrical performance is not comprised. Utilizing BGA attachment in a connector construction that provides lead compliancy, NeXLev provides the highest level of solder joint reliability.

For more information on NexLev, or to obtain an outline of the NeXLev compliance report, visit www.teradyne.com/tcs.

About Teradyne Connection Systems Division

Teradyne Connection Systems (TCS), a division of Boston-based Teradyne, Inc., provides high performance system solutions to industry leading OEMs, with printed circuit boards, high-speed, high-density connectors, multi-gigabit backplane assemblies and complete systems integration and test. Teradyne's high-technology components and electronic manufacturing services are used by manufacturers of communications equipment and computing systems central to building networking infrastructure. For more information visit www.teradyne.com/tcs.

About Teradyne Inc.

Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection products and total systems integration services. Teradyne's automatic test products are used by manufacturers of semiconductors, circuit assemblies and voice and broadband telephone networks. Teradyne's high-technology components and electronic manufacturing services are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $3 billion in 2000. For more information visit www.teradyne.com.

“Telcordia compliance assures our customers that our connectors will perform to satisfaction over the expected life of their products”