Teradyne Introduces New FLASH 750 MicroCOSM Memory Test System; Reduces Semiconductor Manufacturer`s Time to Market

SAN JOSE, Calif.--(BUSINESS WIRE)--July 18, 2001--Teradyne, Inc. (NYSE:TER) introduces the FLASH 750 MicroCOSM,(TM) extending the FLASH 750(TM) memory test system platform. The FLASH 750 MicroCOSM reduces semiconductor manufacturer's time and cost to ramp into high-volume manufacturing by enabling the development and debug of test programs, DIBs, and probe cards without impacting current production. The MicroCOSM has the same 100MHz electronics, interface correlation and IG-XL software as the high-parallel FLASH 750 production system. The compatibility between systems enables the transfer of test programs into production in the least amount of time-decreasing the time-to-money for ramping new devices. The combination of the MicroCOSM and the FLASH 750 ensures the fastest time to high-volume manufacturing. The U.S. introduction of the new FLASH MicroCOSM was made at the test industry trade show SEMICON West held here July 18-20, 2001.

Segments of the mobile market are driving a diverse set of non-volatile memory requirements. Cell phones are driving stacked devices forcing manufacturers to test the device's performance at wafer sort. At the same time, digital cameras and MP3 players are driving toward incredible densities with multi-level cell and NAND technologies. And, semiconductor manufacturers are being forced to create customer specific memories.

"Semiconductor manufacturers can no longer afford to focus exclusively on a single flash technology," said Mike Palumbo, Marketing Manager of Teradyne's Memory Test Division. "The gyrations of the market now force manufacturers to produce a variety of devices, densities and speed grades with increasing customer specifications. The FLASH 750 MicroCOSM not only assists with generating the test program for tape out, but also in getting the device into high-volume manufacturing through seamless integration with the FLASH 750." Providing Up to Four Times the Throughput A third generation Flash testing architecture built upon Distributed Flash Processing(TM) uses intelligent instruments to make measurements and flow decisions at pattern speed eliminating tester bottlenecks and minimizing tester overhead. At the same time, the multitasking capability of WinCE allows computationally intensive analysis to be hidden behind device testing. Industry leading test times in conjunction with parallelism as high as 128 devices ensure that the FLASH 750 provides the highest throughput.

Increased Test Coverage for Mobile Applications

With 100MHz performance, the FLASH 750 provides full performance verification for memories that will be stacked with other die, while the logic test capability inherited from the J750 allows single pass testing for devices with embedded memory. The ability to test 512Mb Mask ROMs and up to 4Gb Flash devices ensures that test capability grows with device density. While the capability to measure the total charge being delivered to a device allows manufacturers to differentiate their products for use in battery-powered applications.

IG-XL Software

The FLASH 750 memory test platform features IG-XL test software, the semiconductor ATE industry's first test development suite, combining the power and performance of the latest PC technology and Windows NT operating system with the familiarity of standard Windows productivity tools.

Pricing and Availability

The FLASH 750 MicroCOSM and FLASH 750 are currently shipping. Pricing for a typical FLASH MicroCOSM configuration is $175,000 USD and pricing for the FLASH 750 starts at $750,000 USD.

About Teradyne

Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Teradyne's test products are used by manufacturers of semiconductors, circuit assemblies, voice and broadband telephone networks. Teradyne's backplane assemblies and high-density connectors are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $3.0 billion in 2000 and currently employs about 9000 people worldwide. For more information visit www.teradyne.com.

“Semiconductor manufacturers can no longer afford to focus exclusively on a single flash technology”