Teradyne Expands New Test Solutions Because Technology Never Stops; Showcasing at SEMICON West new test advancements accelerating technology for a wide range of markets

BOSTON--(BUSINESS WIRE)--July 12, 2001--Teradyne (NYSE: TER) announced that it will unveil several new products and test solutions at the industry tradeshow SEMICON West (Booth #11008) held July 18-20 in San Jose, CA. Products being demonstrated for the first time in the U.S. include; the FLASH 750 MicroCOSM memory test system, the J750k test system priced at less than $1K per pin and the new Probe-One memory test system for the test and repair of DRAM wafers. Using Teradyne's new "eConnectNet", two wireless demonstrations employing remotely located Catalyst systems will be performed: a Bluetooth(tm) Quadsite including handler control on a system located at Boston and an 802.11a Wireless Local Area Network (WLAN) device on a system located at a Teradyne field office.

"Technology is moving forward. Semiconductor manufacturers constantly advance technology while bringing new products to market faster at increasingly competitive prices," said Roger Saylor, Vice President, Sales, at Teradyne. "Hitting the technology target for manufacturers must be done while not sacrificing time to volume production, especially in today's economic environment. Teradyne's advanced test technology enables customers to get their innovations to market sooner and at a lower cost."

Following are the advanced test technologies ready to deliver practical solutions that will be highlighted at SEMICON West 2001:

J750 and J750k

At SEMICON West, the Integra Test Division will demonstrate the testing of low-end, mixed-signal devices with the Mixed Signal Option (MSO); and the new APMU (Analog Pin Measurement Unit) enhancement tool - the J750's MSO complement to test power management functions for integrated base-band devices. The J750 delivers up to 1,024 digital channels into a zero footprint system entirely contained within a test head. Its high-throughput parallel testing capabilities help deliver 95% parallel test efficiency for up to 32 devices. The J750 family of test systems delivers the architecture, hardware and PC-based software that ensures high test coverage and low test cost for low-end and mid-range semiconductors like, microcontrollers, FPGAs, PLDs, EEPROMs, ASICs, and baseband, digital audio and video devices. The J750k, the newest member of the J750 family of test systems, was designed specifically to reduce the cost of test without compromising production efficiency, flexibility or reliability. The J750k delivers the lowest priced (entry level price of $99k) leading edge ATE technology on the market, with all the advantages of the J750 family.

FLASH 750 MicroCOSM

This is the first U.S. public showing of the FLASH 750 MicroCOSM(TM). The FLASH 750 MicroCOSM extends the FLASH 750(TM) memory test system platform. The FLASH 750 MicroCOSM reduces semiconductor manufacturer's time and cost to ramp into high-volume manufacturing by enabling the development and debug of test programs, DIBs, and probe cards without impacting current production. The MicroCOSM has the same 100MHz electronics, interface correlation and IG-XL software as the high-parallel FLASH 750 production system. The compatibility between systems enables the transfer of test programs into production in the least amount of time-decreasing the time-to-money for ramping new devices. The combination of the MicroCOSM and the FLASH 750 ensures the fastest time to high-volume manufacturing.

Probe-One

A presentation at SEMICON West will describe the recently introduced Probe-One memory test system. This new system is the first memory test system with an architecture specifically designed for the emerging requirements of high-parallel test and repair of DRAM wafers. Teradyne's new Probe-One delivers the shortest possible test time per wafer, the lowest test cost, and an unprecedented technological lifespan. The Probe-One's Flex-Die(TM) architecture delivers the maximum parallelism per wafer, while providing the ultimate in scalable performance. The system can be configured in speeds of 62, 125, or 250 MHz, with Dual 3D Catch RAM(TM) ranging in size from 6 up to 384 Gigabits, and with 64 to 512 SiARA-II(TM) redundancy processors.

Catalyst Tiger

The Tiger, on display at SEMICON West, is the first SOC system offering economical at-speed testing with Real I/O(TM) data rates to 1.6 Gbps. At any digital data rate, Real I/O provides superior fault coverage and shorter test times, making Tiger the test system suitable for today's testing requirements. Powered by breakthrough Silicon Germanium (SiGe) technology, Tiger sets the new digital performance standard. At SEMICON West, Teradyne's Catalyst Tiger will offer full performance test coverage for SOCs including SONET/SERDES, "Zero-Chip" Bluetooth(TM) at production speed and BBAC(TM) Instrumentation for low frequency, high performance analog testing of broadband devices.

Catalyst

Catalyst dominates the SOC market with test capabilities for DSL, wireless, microwave and power management applications. Using Teradyne's innovative "eConnectNet", two wireless demonstrations will be performed by remote access from SEMICON West. Quadsite Bluetooth test with MicroWAVE6000 and a Seiko Epson handler will be demonstrated along with an 802.11a WLAN test with MicroWAVE6000, and Atheros Communications Radio-on-a-Chip. The test systems will be accessed from Teradyne's world headquarters and a field office.

VX Test Simulation Software

VX is a powerful tool that reduces time to market and lowers capital investments. VX accomplishes this by shifting test program development and debug and into the design phase of IC development and puts the power of simulation directly into the hands of the test engineer. VX software is an integral part of Teradyne's Catalyst, Catalyst Tiger and A5 Family test systems.

About Teradyne

Teradyne (NYSE:TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Teradyne's test products are used by manufacturers of semiconductors, circuit assemblies and voice and broadband telephone networks. Teradyne's backplane assemblies and high-density connectors are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $3 billion in 2000 and currently employs about 9000 people worldwide. For more information visit www.teradyne.com.

IMAGE and BBAC are trademarks of Teradyne, Inc.

Bluetooth is a trademark owned by the Bluetooth SIG, Inc.

“Hitting the technology target for manufacturers must be done while not sacrificing time to volume production, especially in today's economic environment. Teradyne's advanced test technology enables customers to get their innovations to market sooner and at a lower cost.”