Meeting the production demands of multiple customers and test economics are key drivers in the subcontractor market. Tiger's test speed, performance and configuration flexibility enables subcontractors to test evolving and increasingly complex devices. Multi-site test with Tiger's parallel processing architecture, integrated analog, and next generation scalable digital yields the high throughput required in today's market.
"We view the selection of Tiger as an investment in our capabilities that enables us to expand and meet our customer's needs," said Yean Hung Chok, Vice President, Product and Test Engineering, UTAC. "In addition to excellent test performance, Tiger's capabilities are a catalyst for UTAC winning key customers in the broadband communications market. UTAC's partnership with Teradyne better positions us to support our growing customer base and the growing test demands of the high-performance SOC market."
"The recent purchase of multiple Tiger test systems is a continuation of the strong partnership Teradyne shares with UTAC," said Jeff Schneider, Marketing Manager, Teradyne. "We are pleased that UTAC has repeatedly turned to the speed and flexibility of Teradyne's Tiger to support their growth in areas such as the broadband communication market."
About Tiger
The Catalyst Tiger is the first over 1 Gbps SOC test system. Extending the Catalyst Family, Tiger shares the same high throughput zero-time DSP architecture, IMAGE software and state-of-the-art analog instruments and extends the Catalyst Family to 1024 digital pins. Powered by breakthrough Silicon Germanium (SiGe) technology, Tiger sets a new digital performance standard with full I/O data rates to 1.6 Gbps while retaining the timing flexibility at top speed demanded by chipset and network processing applications. The flexibility of Tiger allows customers to configure their system to meet the test needs of a broad range of devices.
About UTAC
United Test and Assembly Center Ltd. (UTAC), founded in November 1997, is a world-class semiconductor services provider, partnering with customers to develop and provide semiconductor service solutions. UTAC, QS9000 certified, provides one-stop semiconductor assembly and testing services for memory, logic and mixed signal devices. UTAC's assembly and test services address a full range of packages, including TSOP, QFP, LQFP, FBGA, PBGA, QFN, LCC and EBGA. The company's headquarters, housing a 390,000 square foot test/assembly area and 50,000 square foot cleanroom, is located in Singapore. More information about the company, its products, and services may be obtained from the worldwide web at http://www.utac.com.sg.
About Teradyne
Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Teradyne's test products are used by manufacturers of semiconductors, circuit assemblies, voice and broadband telephone networks. Teradyne's backplane assemblies and high-density connectors are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $3.0 billion in 2000 and currently employs about 9000 people worldwide. For more information visit www.teradyne.com.
IMAGE is a trademark of Teradyne, Inc.
“We are pleased that UTAC has repeatedly turned to the speed and flexibility of Teradyne's Tiger to support their growth in areas such as the broadband communication market.”
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