Global Phase Change Thermal Interface Materials (PCTIM) Market 2018 Forecast to 2023 - Key Players are Henkel, Dow Corning, Microtek Labs, Parker Chomerics, Croda, and Sunoco - ResearchAndMarkets.com

DUBLIN--()--The "Global Phase Change Thermal Interface Materials Market - Segmented by Conductive Type, Binder Type, Filler Type End-user Industry, and Geography - Growth, Trends and Forecasts (2018 - 2023)" report has been added to ResearchAndMarkets.com's offering.

The global market is expected to register a CAGR of 11.84% during the forecast period of 2018-2023. Growing consumer electronics industry is expected to significantly drive the market through the forecast period.

Phase change thermal interface materials (PCTIM) are penetrating the consumer electronics industry, owing to the need to dissipate large amounts of heat from the semiconductor device junction to ambient surroundings. Asia-Pacific is expected to remain at the forefront of the global demand for electronics. The demand for PCTIMs in Asia-Pacific is witnessing high growth, owing to rapid internet penetration in developing nations.

Video on demand (VoD) and internet-only shows are growing in popularity, thereby increasing demand for larger displays like laptops and tablets, which are expected to increase the consumption in the electronics industry. As the electronics industry continues to grow, the market for PCTIM will also increase rapidly.

In terms of consumption in 2017, Asia-Pacific accounts for more than 33% of the market, followed by North America and Europe. The extensive demand for the phase change thermal interface materials in countries, such as India and China, from the construction and the electronics sectors have made Asia-Pacific an area of immense potential and opportunities.

Major players are Henkel AG & Co. KGaA, Dow Corning, Microtek Laboratories, Parker Chomerics, Croda International, and Sunoco, amongst others.

Key Developments in the Market

  • May 2017: Boyd Corporation Completed the acquisition of Aavid Thermalloy.
  • March 2017: Honeywell announced the availability of a Thermal Interface Materials (TIM) solution to help smartphone manufacturers and designers manage heat dissipation in phones.

Key Topics Covered

1. Introduction

2. Executive Summary

3. Market Insights

4. Market Dynamics

5. Market Segmentation and Analysis

6. Regional Analysis

7. Competitive Landscape

8. Company Profiles

  • 3M
  • Aavid Thermalloy
  • AI Technology
  • Arctic Silver
  • Bergquist Company
  • Dow Corning Corp.
  • Enerdyne Thermal Solutions
  • Henkel AG & Co. KGaA
  • Indium
  • Laird Technologies
  • Momentive
  • NuSil Technology
  • Parker Chomerics
  • Shin-Etsu Chemical
  • Stockwell Elastomerics
  • Wakefield-Vette

9. Future of the Market

For more information about this report visit https://www.researchandmarkets.com/research/49vl2b/global_phase?w=4

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com

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Related Topics: Advanced Materials, Semiconductor, Plastic Additives

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com

For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

Related Topics: Advanced Materials, Semiconductor, Plastic Additives