DUBLIN--(BUSINESS WIRE)--The "Global 3D IC & 2.5D IC Packaging Market Analysis & Trends - Industry Forecast to 2027" report has been added to ResearchAndMarkets.com's offering.
The Global 3D IC & 2.5D IC Packaging Market is poised for strong growth during the forecast period 2017 to 2027
Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
This industry report analyzes the market estimates and forecasts of all the given segments on global as well as regional levels presented in the research scope. The study provides historical market data for 2015, 2016 revenue estimations are presented for 2017 and forecasts from 2018 till 2027.
The study focuses on market trends, leading players, supply chain trends, technological innovations, key developments, and future strategies for the existing players, new entrants and the future investors.
Scope of the Report
- In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).
- By End User the market is segmented into automotive, consumer electronics, medical devices, military & aerospace, telecommunication, industrial sector and smart technologies.
- Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.
Key Topics Covered:
1 Market Outline
2 Executive Summary
3 Market Overview
4 3D IC & 2.5D IC Packaging Market, By Packaging Technology
5 3D IC & 2.5D IC Packaging Market, By End User
6 3D IC & 2.5D IC Packaging Market, By Application
7 3D IC & 2.5D IC Packaging Market, By Geography
8 Key Player Activities
9 Leading Companies
- Intel Corporation.
- Toshiba Corp.
- Samsung Electronics Co., Ltd.
- Stmicroelectronics Nv
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Taiwan Semiconductor Manufacturing Company Limited
- Amkor Technology
- United Microelectronics Corp.
- Broadcom Ltd.
- ASE Group
- Pure Storage Inc
- Advanced Semiconductor Engineering Group
For more information about this report visit https://www.researchandmarkets.com/research/rwwk4p/global_3d_ic_and?w=4
