Rudolph Technologies to Participate in the Sixth Annual NYC Investor Summit 2017

WILMINGTON, Mass.--()--Rudolph Technologies (NYSE: RTEC), today announced that company management is scheduled to participate in the 6th Annual NYC Investor Summit 2017, being held December 6, 2017 at the Le Parker Méridien Hotel, New York, NY.

The presentation material utilized during the conference will be made accessible on the investor page of Company’s website at www.rudolphtech.com.

About the NYC Investor Summit
The NYC Investor Summit is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration. During the event, investors and analysts will have the opportunity to meet with up to 10 of the 14 management teams during the 30-minute group meeting sessions, as well as opportunities to meet with additional management teams during the breakfast and lunch networking sessions.

The 14 management teams collectively hosting the 2017 NYC Investor Summit include: Aehr Test (AEHR), Axcelis (ACLS), BE Semiconductor Industries (BESI.AS), Brooks (BRKS), Camtek (CAMT), Cohu (COHU), Electro Scientific (ESIO), FormFactor (FORM), Ichor Systems (ICHR), inTEST (INTT), Intevac (IVAC), Kulicke & Soffa (KLIC), Nanometrics (NANO), and Rudolph Technologies (RTEC). Sponsoring the networking luncheon is Cowen & Co.

The NYC Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is November 27, 2017.

RSVP Contacts for the 6th Annual NYC Investor Summit 2017
To RSVP for the NYC Investor Summit, please contact either of the Summit’s co-chairs.

Laura J. Guerrant-Oiye
Guerrant Associates
Phone: (808) 960-2642
Email: lguerrant@guerrantir.com

Claire E. McAdams
Headgate Partners LLC
Phone: (530) 265-9899
Email: claire@headgatepartners.com

About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

Contacts

Rudolph Technologies, Inc.
Investors:
Michael Sheaffer, 978-253-6273
Senior Director, Corp. Communications
Mike.Sheaffer@rudolphtech.com

Release Summary

Rudolph is pleased to participate in the 6th Annual NYC Investor Summit 2017 on December 6. Mike Plisinski and Steve Roth will be available to meet.

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Contacts

Rudolph Technologies, Inc.
Investors:
Michael Sheaffer, 978-253-6273
Senior Director, Corp. Communications
Mike.Sheaffer@rudolphtech.com